Preparation method for microwave dielectric ceramic/resin bicontinuous composite material for PCB substrate

A technology of microwave dielectric ceramics and composite materials, which is applied in the field of preparation of composite materials, can solve the problems of large dielectric loss of ceramics, and achieve the effects of high density, reduced interface polarization, and low water absorption

Active Publication Date: 2015-06-10
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention is to solve the technical problem of large dielectric loss of ceramics prepared by existing methods, and provides a method for preparing microwave dielectric ceramic / resin double continuous composite materials for PCB substrates

Method used

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  • Preparation method for microwave dielectric ceramic/resin bicontinuous composite material for PCB substrate
  • Preparation method for microwave dielectric ceramic/resin bicontinuous composite material for PCB substrate
  • Preparation method for microwave dielectric ceramic/resin bicontinuous composite material for PCB substrate

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specific Embodiment approach 1

[0021] Specific implementation mode 1: In this implementation mode, the preparation method of microwave dielectric ceramic / resin double continuous composite material for PCB substrate is carried out according to the following steps:

[0022] 1. Add deionized water to the ceramic powder, the volume ratio of ceramic powder to deionized water is (1~2):(3~4), add dispersant and binder, mix and disperse in the mixer for 12 hours, Obtain a uniform and stable slurry;

[0023] The addition amount of the dispersant is 0.5-1.0% of the mass fraction of the ceramic powder, and the addition amount of the binder is 1.0% of the mass fraction of the ceramic powder;

[0024] 2. Pour the slurry in step 1 into a mold after vacuum defoaming for 10 minutes, keep it warm in a low-temperature refrigerator at -60°C for 10-20 minutes, and then freeze-dry for 2-3 days to obtain a porous ceramic green body with oriented pores;

[0025] 3. Place the porous ceramic green body in a muffle furnace, raise t...

specific Embodiment approach 2

[0027] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the ceramic powder described in step one is ZnNb 2 o 6 Ceramic powder or BaTi 4 o 9 ceramic powder. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0028] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the dispersant described in step 1 is polyacrylic acid (PAA). Others are the same as those in the first or second embodiment.

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Abstract

The invention belongs to the field of composite material preparation, and relates to a preparation method for resin matrix composite materials, in particular to a preparation method for a microwave dielectric ceramic/resin bicontinuous composite material for a PCB substrate. The method aims at solving the technical problems that a ceramic/resin composite material obtained through an existing method has a low dielectric constant and large dielectric losses. The preparation method comprises the steps of 1, preparing a sizing agent; 2, preparing a porous ceramic green body with directional holes; 3, preparing a porous microwave dielectric ceramic preform body; 4, pouring resin at the temperature ranging from minus 20 DEG C to the normal temperature into a mold, conducting vacuumizing until the molten resin completely enters the porous microwave dielectric ceramic preform body, and conducting solidification to obtain the microwave dielectric ceramic/resin bicontinuous composite material. Due to the fact that the specific surface area of the porous microwave dielectric ceramic preform body is much smaller than the specific surface area of powder, interfacial polarization is lowered, and dielectric losses are lowered; in addition, the composite materials of different ceramic contents can be obtained according to the material requirement, and the dielectric constant is adjustable.

Description

technical field [0001] The invention relates to a preparation method of a composite material. Background technique [0002] Under high-frequency conditions, PCB boards not only play the role of structural parts and connectors, but also become part of functional components. In order to ensure that the signal delay and distortion in high-frequency microwave circuits are as small as possible, reduce the mutual interference between signals, and improve the transmission quality of signals, materials are required to have good dielectric properties in the high-frequency range and high heat resistance. and excellent mechanical properties. Generally speaking, it is difficult for single-component materials to have excellent dielectric properties and mechanical properties at the same time. Polymers have the characteristics of easy processing and high mechanical strength, but their dielectric constants are generally low, and they are brittle for typical inorganic materials. Large, hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/04C08K3/22C04B35/622
Inventor 叶枫张标高晔刘强刘仕超马杰丁俊杰
Owner HARBIN INST OF TECH
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