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3dic package with hotspot thermal management components

A technology of heat dissipation components and packages, which is applied in semiconductor/solid-state device components, electrical components, electric solid-state devices, etc., and can solve problems affecting the reliability of 3DIC packages that affect electrical performance

Active Publication Date: 2017-10-24
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, hot spots created by heat generated by devices at the bottom of the stacked die may also adversely affect the electrical performance of other overlapping devices located in the stacked die as well as the reliability of the overall 3DIC package

Method used

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  • 3dic package with hotspot thermal management components
  • 3dic package with hotspot thermal management components
  • 3dic package with hotspot thermal management components

Examples

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Embodiment Construction

[0031] The making and using of embodiments of the invention are discussed in detail below. It should be appreciated, however, that the embodiments provide many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are illustrative, and do not limit the scope of the invention.

[0032] Packages having effective hot spot thermal management components and methods of forming the same are provided in accordance with various exemplary embodiments. Intermediate stages in forming the package are shown. Variations of the examples are discussed. Like reference numerals are used to refer to like elements throughout the various views and illustrative embodiments.

[0033] Figure 1A A cross-sectional view is shown at initial stages in forming a three-dimensional integrated circuit (3DIC) package 100 comprising die 10 stacked on die 12 forming die stack 10 / 12 . In some embodiments, die 10 is a memory die forming...

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Abstract

The present invention provides a package including a substrate having a conductive layer, and the conductive layer includes an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacts the exposed portion of the conductive layer. The package also includes a cam ring positioned over and in contact with the high thermal conductivity material. The present invention relates to 3DIC packages with hot spot thermal management components.

Description

technical field [0001] The present invention relates to 3DIC packages with hot spot thermal management components. Background technique [0002] In the packaging of integrated circuits, semiconductor die may be stacked by bonding and may be bonded to other packaging components, such as an interposer or packaging substrate. The resulting package is known as a three-dimensional integrated circuit (3DIC). Heat dissipation is a challenge in 3DIC. There is a bottleneck in efficiently dissipating the heat generated in the internal die of the 3DIC. The heat generated in the internal die must be dissipated to external components such as the external die before this heat can be conducted to any heat sinks. However, there are other materials, such as underfill, molding compound, etc., that do not efficiently conduct heat between the stacked dies. As a result, heat may be trapped in the interior region of the bottom stack die and cause strong localized temperature peaks (sometimes ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L23/367
CPCH01L2924/181H01L23/04H01L23/10H01L24/13H01L24/16H01L24/73H01L24/92H01L25/0652H01L25/0657H01L25/18H01L2224/13025H01L2224/131H01L2224/16145H01L2224/16227H01L2224/29011H01L2224/291H01L2224/2919H01L2224/29339H01L2224/32245H01L2224/33181H01L2224/73204H01L2224/73253H01L2224/81815H01L2224/83191H01L2224/92125H01L2224/92225H01L2225/06517H01L2225/06589H01L2924/1432H01L2924/1434H01L2924/15311H01L2924/16153H01L2924/16251H01L2924/1679H01L2924/19041H01L2924/19042H01L2924/19043H01L2924/19105H01L2225/06513H01L2225/06541H01L2225/06568H01L2224/29294H01L23/3675H01L23/3677H01L23/42H01L23/49816H01L23/49822H01L23/49827H01L24/32H01L24/83H01L2224/32225H01L2224/33519H01L2924/1431H01L2924/1436H01L23/36H01L2924/00H01L2924/014H01L2224/16225H01L23/3735H01L2023/4018
Inventor 洪文兴黄思博李祥帆陈锦棠吴集锡郑心圃
Owner TAIWAN SEMICON MFG CO LTD