Method for processing printed circuit board and printed circuit board

Abstract

The embodiment of the invention discloses a method for processing a printed circuit board and the printed circuit board. Among them, a method of processing a printed circuit board mainly includes: pressing the first heat dissipation metal base between the first plate set and the second plate set; wherein, the first surface of the first heat dissipation metal base has N heat dissipation Metal pillars, N is a positive integer; part of the plates on the surface of the first plate set is removed, so that part of the pillars of at least one of the N heat dissipation metal pillars on the first surface of the first heat dissipation metal base extends out The surface of the first plate set; a pluggable second heat dissipation metal base is arranged on the surface of the first plate set, wherein some columns are inserted into the grooves on the second heat dissipation metal base. The embodiments of the present invention provide technical solutions that are beneficial to improving the heat dissipation performance of the heat dissipation structure in the printed circuit board.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, in particular to a method for processing a printed circuit board and the printed circuit board. Background technique [0002] Heat dissipation is very important to printed circuit board (PCB, Printed Circuit Board). Good heat dissipation performance can prolong the service life of PCB, otherwise it may shorten the service life of PCB and affect the stability of PCB work. [0003] At present, there are more and more applications of high-power devices, and their corresponding currents are correspondingly larger and larger, and the lines carrying high currents are generally placed in the inner layer of the PCB to avoid affecting the safety of the device and the signal layer of the outer layer. interference. But the ensuing problem is that when the inner layer runs a large current, it will generate a large amount of heat that cannot be transferred to the outside in time for rapid h...

AI Technical Summary

Problems solved by technology

But the ensuing problem is that when the inner layer carries a large current, it will generate a large amount of heat that cannot be transferred to the outside in time for rapid heat dissipation, resulting in an excessively high temperature rise of the PCB, which will cause extreme heat-sensitive devices such as surface capacitance and resistors. Large impact or even damage, which will affect the performance of the overall PCB

[0004] The existing PCB heat dissipation structure is usually achieved by opening slots on the PCB and filling the slots with heat dissipation materials. The processing of this heat dissipation structure is cumbersome, and the combination of heat dissipation materials and PCB is difficult to be guaranteed. The heat dissipation area is relatively small, which affects the heat dissipation performance, and the heat dissipation performance is especially difficult to meet the needs of high current scenarios

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