Semiconductor film thickness measurement calibration standard sheet and manufacturing method thereof

Abstract

The invention discloses a semiconductor film thickness measurement calibration standard sheet and a manufacturing method thereof. The calibration standard sheet comprises a wafer substrate and at least two pattern regions which are located on the surface of the wafer substrate and are of different film thickness levels. Due to the fact that the pattern regions of the different thickness levels are formed on the same standard sheet, the same standard sheet can be adopted for calibrating multiple thickness levels. Compared with the prior art, the expense for purchasing the standard sheet can be saved, the measurement use rate of a film thickness measurement table used for a product is increased, the work efficiency of operators is improved, and meanwhile the wafer breakage probability and the management and control efficiency of a wafer of the standard sheet are reduced.

Description

technical field [0001] The invention relates to semiconductor testing technology, in particular to a calibration standard sheet used in semiconductor film thickness measuring equipment and a manufacturing method thereof. Background technique [0002] With the continuous development of semiconductor manufacturing technology, the role of measurement equipment is becoming more and more important. It is also extremely important to ensure the accuracy of semiconductor measurement. To ensure the accuracy of measurement, it is necessary to rely on standard plates to regularly calibrate the equipment. . [0003] Semiconductor production plants have various types of measurement machines (equipment), and the equipment for film thickness measurement requires thickness measurement calibration standard sheets. At present, a set of thickness measurement calibration standard sheets is composed of several wafers, each wafer is used to calibrate a thickness value, and a layer of carbon diox...

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Problems solved by technology

[0004] It can be seen from the above description; in the existing technology, multiple standard sheets are required to calibrate a measuring machine, and the current general standard sheets are relatively expensive, requiring a large amount of money to purchase and routinely test the standard sheets every year. In addition, during the calibration process, the measuring machine needs to load (load) and unload (unload) different grades of standard sheets multiple times. On the one hand, it will take a lot of time and reduce the output of the machine for product measurement. rate, on the other hand, it will increase the risk of standard wafer damage during the transmission process; moreover, it is difficult to store multiple standard wafers uniformly

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