Depositing apparatus
A technology of evaporation and edge position, applied in vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve the problems of reduced pattern precision and reduced adhesion
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[0056] The advantages and features of the present invention and their realization methods will become clearer with reference to the embodiments described later in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and can be realized in various forms different from each other. The embodiments of the present invention are only to make the disclosure of the present invention more complete, and to contribute to the common knowledge in the technical field to which the present invention belongs. It is provided by knowledgeable persons to fully convey the scope of the present invention, and the present invention is defined only by the scope described in the claims. Throughout the specification, the same reference numerals denote the same constituent elements. The sizes and relative sizes of layers and regions in the drawings may be shown exaggerated for clarity of illustration.
[0057] When it is indi...
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