IC card packaging device and method

A packaging device and packaging method technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as shrinkage deformation, poor user sensory experience, and affecting the aesthetics of the card surface.

Active Publication Date: 2015-06-24
HONGBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Based on the above reasons, it is necessary to provide a technical solution for IC card packaging to solve the problem that the plastic card base shrinks and deforms due to softening during the process of embedding the IC card chip into the card bo

Method used

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  • IC card packaging device and method
  • IC card packaging device and method

Examples

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[0038] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0039] see figure 2 , is the IC card schematic diagram after encapsulation; Described IC card 9 comprises plastic card base 91 and IC card chip 92, from figure 2 It can be seen from the figure that when the chip is embedded in the card body of the plastic card base, it cannot completely fill the chip slot on the plastic card base, so there is still a certain space in the chip slot on the plastic card base below the IC card chip 92. Empty area 93. In this way, during the packaging process of the IC card, due to the existence of the avoidance area, the plastic card base is prone to shrinkage and deformation when it is cooled, which leads to the back of the packaged plastic card base (that is, the other side opposite to the chip side) on t...

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Abstract

The invention discloses an IC card packaging device and method. The IC card packaging device comprises a packaging platform, hot pressing devices, cold pressing devices, negative pressure devices, a transmission device and power devices, wherein the hot pressing devices and the cold pressing devices are sequentially arranged in the IC card transmission direction, the hot pressing devices comprise hot pressing heads, and the hot pressing heads are internally provided with heating devices; the cold pressing devices comprise cold pressing heads, the packaging platform is provided with card grooves adapted to the size of an IC card, the bottom surface of each card groove is provided with adsorption holes, and the negative pressure devices are communicated with the adsorption holes. When the cold pressing heads conduct cold pressing on the IC cards in the card grooves, plastic card bases in the card grooves are absorbed by the adsorption holes through negative pressure, so that the lower surfaces of the plastic card bases in a softening state become regular and flat, and then the beautiful degree of the card surfaces is greatly improved.

Description

technical field [0001] The invention relates to the field of IC card production and processing, in particular to an IC card packaging device and method. Background technique [0002] Since the promotion of IC cards, they have been popularized rapidly. Up to now, the number of IC cards issued has exceeded 1 billion, accounting for more than 80% of the total number of newly issued bank cards. In order to further increase the utilization rate of financial IC card chips and reduce the risk of counterfeit cards, according to the deployment of the central bank, IC cards will completely replace magnetic stripe cards from January 1, 2015. In this context, in the next few years, the demand for IC cards will continue to rise, and the production and processing of IC cards has a broad market prospect. [0003] In the process of IC production and processing, encapsulating IC cards is an important link. Existing IC cards generally include financial IC card chips and plastic card bases. T...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/50
CPCH01L21/67011H01L21/50H01L21/67121
Inventor 罗长兵陈晋杰高强刘源海
Owner HONGBO CO LTD
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