Film uncovering and feeding device

Abstract

The invention provides a film uncovering and feeding device which comprises a material storage mechanism which is provided with a material containing assembly capable of ascending and descending and is used for storing a plurality of single-piece type materials and feeding the single-piece type materials in a flattened state; the film uncovering mechanism is provided with a material supporting assembly, and the part, separated from the bottom film, of the pasted material is supported during film uncovering, so that the pasting device sucks the pasted material conveniently; the feeding mechanism is provided with a corner folding assembly, and after a single piece of material is loaded to the film uncovering mechanism through the feeding mechanism, the corner folding assembly conducts corner folding on the bottom film so that the bottom film can be bent to be uncovered; the feeding mechanism uploads a plurality of single-sheet materials in the material storage mechanism to the film uncovering mechanism in a single-sheet mode, the corner folding assembly bends a bottom film, the pasted materials are separated from the bottom film at the bending position, the material supporting assembly supports the pasted materials, the pasted materials are in a flattened state, and automatic single-sheet feeding and automatic film uncovering are achieved. The automatic pasting machine can be applied to an automatic production line.

Description

technical field [0001] The invention belongs to the technical field of film peeling equipment, in particular to a film peeling feeding device. Background technique [0002] In the process of filming existing electronic products, the materials are fed in rolls, and the retractable feeder is used for feeding and peeling. This situation is suitable for bendable materials, but for some single-use materials Sheets of incoming film materials, such as Figure 14 As shown in the figure, the film material is a single sheet, and a plurality of sticking materials 7 are arranged on the bottom film 6. When feeding, the material is loaded in a single sheet, and no bending is allowed, and it cannot be carried out in the form of a roll. Feeding materials, such as copper foil, double-sided tape with waterproof requirements, etc., the pasting material 7 will be bent after bending, and the quality problem will easily occur after the pasting material 7 is pasted, and its flatness cannot meet th...

AI Technical Summary

Problems solved by technology

[0002] In the process of pasting films on existing electronic products, materials are fed in rolls, and retracted feeders are used to feed and remove the film. This situation is suitable for bendable materials, but for some Sheet form incoming film material, such as Figure 14 As shown, the film material is a sheet type, and a plurality of pasting materials 7 are arranged on the bottom film 6. When feeding, the material is loaded in the form of a sheet, and bending is not allowed, and it cannot be carried out in the form of a coil. Material supply, such as: copper foil, double-sided tape with waterproof requirements, etc., after bending, the pasting material 7 will be bent, and the pasting material 7 is prone to quality problems after pasting, and its flatness cannot meet the film-sticking requirements. For this kind of leaflet Form of film materials, the existing manual peeling film, manual operation in a single state, low work efficiency, automatic feeding and automatic film removal, can not be used in automated production lines

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