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Inductor structure with predefined current returns

A technology of inductors and currents, applied in the direction of fixed inductors, inductors, fixed signal inductors, etc., can solve problems such as unpredictable and quantified electrical interactions

Active Publication Date: 2017-05-17
XILINX INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, many electrical interactions such as inductive coupling are difficult to predict and quantify within an IC implemented using modern IC manufacturing techniques

Method used

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  • Inductor structure with predefined current returns
  • Inductor structure with predefined current returns
  • Inductor structure with predefined current returns

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Embodiment Construction

[0017] Although the specification concludes with claims defining novel features, it is believed that the various features disclosed within this specification will be better understood from consideration of the description in conjunction with the drawings. The process, machine, manufacture, and any variations thereof described within this specification are presented for illustrative purposes. Specific structural and functional details disclosed within this specification are not to be interpreted as limiting, but merely as a basis for the claims and as a means to teach one skilled in the art to variously employ any appropriate detail in practice. representative basis for the features described in the structures described. Furthermore, the terms and phrases used in this specification are not intended to be limiting, but to provide an understandable description of the described features.

[0018] One or more examples disclosed within this specification pertain to semiconductor in...

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Abstract

An inductor structure implemented within a semiconductor integrated circuit (IC) includes: a coil (105) of conductive material comprising at least one turn; and a current return (130, 500) surrounding the coil. The current return is formed from a plurality of interconnected metal layers (510, 515, 520, 525) of the semiconductor integrated circuit.

Description

technical field [0001] One or more embodiments disclosed in this specification relate to semiconductor integrated circuits (ICs), and more particularly to an inductor structure for a semiconductor IC. Background technique [0002] Semiconductor integrated circuit (IC) technology continues to evolve to support smaller feature sizes. Smaller feature sizes help produce smaller devices, thereby allowing a greater number of devices to be implemented within a given area of ​​an IC. As devices are implemented closer to each other and the total number of devices within an IC increases, the number of electrical interactions between the devices also tends to increase. [0003] One example of electrical interaction is inductive coupling. Inductive coupling can degrade the performance of devices (and specifically inductors) implemented within an IC. Implementing inductors within ICs is increasingly important because modern circuits operate at higher frequencies and require impedance ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L49/02H01L23/522H01L23/64H01F17/00
CPCH01L23/5227H01L23/645H01L28/10H01L2924/0002H01F17/0013H01L2924/00
Inventor 景晶吴淑贤帕瑞格·尤帕德海亚
Owner XILINX INC