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Self-destruction microsystem and self-destruction method for non-volatile memory chip self-destruction

A memory chip and microsystem technology, applied in the field of information security and self-destruction, can solve problems such as difficult to adapt to the self-destruction of storage medium hardware

Inactive Publication Date: 2016-09-14
刘鹏 +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult to adapt to the self-destruction requirements of various storage media hardware based on the method of high current burning

Method used

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  • Self-destruction microsystem and self-destruction method for non-volatile memory chip self-destruction
  • Self-destruction microsystem and self-destruction method for non-volatile memory chip self-destruction
  • Self-destruction microsystem and self-destruction method for non-volatile memory chip self-destruction

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Such as figure 1 As shown, the non-volatile memory chip self-destruct microsystem of the present embodiment includes: a package body, a miniature ignition chip, a memory chip and a self-destruction decision chip; wherein, the package body includes a package shell and a lead frame; Installed on the upper surface of the lead frame; the micro-ignition chip includes a micro-transducer and a micro-safety release unit, and a pair of ignition electrodes of the micro-transducer is connected in parallel with a pair of safety control electrodes of the micro-safety-release unit, and through the lead The two firing pins of the foot frame are respectively connected to the firing control terminal and the ground terminal of the self-destruction decision-making chip. The release control electrode is respectively connected to the release control terminal and the ground terminal of the self-destruct decision-making chip through the two release control pins of the lead frame; the package ...

Embodiment 2

[0034] Such as figure 2 As shown, in this embodiment, the package body is packaged with a memory chip, a micro ignition chip and a self-destruct decision chip; chip, to achieve package-level integration. Each welding pad on the memory chip is respectively connected to the corresponding memory pin on the lead frame. Others are the same as embodiment one.

[0035] Such as image 3 As shown, the memory chip 200 and the micro ignition chip paste 300 are installed on the upper surface of the lead frame 100; the micro ignition chip 300 includes a miniature energy conversion unit 310 and a miniature safety release unit 320, and a pair of ignition electrodes of the miniature energy conversion unit 310 311 is connected in parallel with a pair of safety control electrodes 263 of the miniature safety release unit, and is respectively connected to the ignition control terminal and the ground end of the self-destruct decision-making chip through two firing pins 102 of the lead frame; ...

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Abstract

The invention discloses a self-destruction micro system for self-destruction of a nonvolatile memory chip and a self-destruction method of the self-destruction micro system. The self-destruction micro system disclosed by the invention comprises a packaging body, a micro inflammation chip, a memory chip and a self-destruction decision chip. When the memory chip is in a normal state, a micro transduction element is in short circuit through a micro security release unit, and thus the micro transduction element cannot be inflamed; when the self-destruction decision chip judges that the memory chip needs to be self-destructed, a security release instruction is transmitted to the micro security release unit through a security release control terminal, the micro security release unit which is in parallel connection with a pair of inflammation electrodes of the micro transduction element can be powered off to release the security protection, subsequently an inflammation signal is transmitted to the micro transduction element from the inflammation control terminal, the micro transduction element can be heated to combust or even detonate an energy-containing agent in the packaging body, a great deal of heat can be released in the reaction process, and the memory chip can be subjected to physical damage which cannot be remedied, so that information in the memory chip can be irretrievably destructed.

Description

technical field [0001] The invention relates to information security and self-destruction technology, in particular to a self-destruction microsystem and a self-destruction method for self-destruction of non-volatile memory chips. Background technique [0002] In recent years, with the development of big data and Internet technology, a large number of mobile devices have been widely used in civilian and military fields as network nodes and network terminals. These removable devices store a large amount of sensitive information. When the device is lost or in a special environment, the safe destruction of information to prevent leakage of user information has become a major problem in the field of information self-destruction. Traditional self-destruction methods are divided into two types: software self-destruction and hardware self-destruction. Among them, the software self-destruction is carried out by using software to erase the data in the storage medium, while the hardw...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B09B3/00
Inventor 刘鹏娄文忠丁旭冉赵越
Owner 刘鹏