Electroplating solution recovery method and device

Abstract

The invention discloses an electroplating solution recovery method and device. The electroplating solution recovery method includes the steps of: raising a circuit board from an electroplating cylinder and shifting it to a position above a recovery cylinder; tilting the circuit board above the recovery cylinder to make the circuit board bottom edge and the horizontal plane at an angle of greater than 0 degree and smaller than 90 degrees; converging the residual electroplating solution on the circuit board at the lowest point of the circuit board, and then dripping the residual electroplating solution into the recovery cylinder. According to the electroplating solution recovery method and device, by tilting the circuit board above the recovery cylinder and making the angle between the circuit board bottom edge and the horizontal plane greater than 0 degree and smaller than 90 degrees, the residual electroplating solution on the circuit board cannot converge on one side to stop and not fall in the process of dripping, but converges at a corner of gravity point to fall concentratedly with an increasing speed. In unit time, the electroplating solution dripping amount is increased so as to enhance the electroplating solution recovery rate. The method and the device are not only suitable for gold plated cylinder liquid medicine recovery, but also suitable for other electroplating lines or liquid medicine lines.

Description

technical field [0001] The invention relates to circuit board electroplating technology, in particular to a method and device for recycling electroplating solution. Background technique [0002] During the gold plating process of the circuit board, after the circuit board is out of the gold plating tank, it is suspended in the air to drop the liquid medicine into the recovery tank. During the recovery process, the circuit board is clamped with a chuck. After the tank is moved to the recovery tank, it is suspended for a certain period of time to drip and recycle the liquid medicine. However, the traditional recovery method has a lot of liquid medicine remaining on the circuit board, which is washed away by the subsequent water washing tank, resulting in a lot of waste. Contents of the invention [0003] Based on this, it is necessary to provide a method and device for recovering electroplating solution to improve the recovery rate of electroplating solution in view of the d...

AI Technical Summary

Problems solved by technology

[0002] During the gold plating process of the circuit board, after the circuit board is out of the gold plating tank, it is suspended in the air to drop the liquid medicine into the recovery tank. During the recovery process, the circuit board is clamped with a chuck. After the tank is moved to the recovery tank, it is suspended for a certain period of time for liquid medicine dripping and recycling, but the traditional recovery method has a lot of liquid medicine remaining on the circuit board, which is washed away by the subsequent water washing tank, resulting in a lot of waste

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