Bijection type ultrasonic module for bank note thickness detection
A thickness detection and ultrasonic technology, applied in the field of through-beam ultrasonic modules, can solve the problems of very high accuracy requirements of thickness detection mechanisms and small detection range of precision sensors, shortening the actual working time, improving the signal processing effect, and simplifying the installation. effect of the way
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[0023] The present invention will be further described in detail below in conjunction with the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
[0024] Such as figure 1 As shown, the through-beam ultrasonic thickness inspection module for banknote thickness inspection of the present invention includes multiple pairs, such as 10 pairs of ultrasonic transmitters and ultrasonic receivers arranged at intervals up and down to form a banknote channel, and a controller, such as programmable logic control. The device FPGA is used to generate control signals and establish communication with external devices through the interface; the interface can adopt SPI communication mode, which can reach a transmission speed of 10Mb / s, which is convenient for the main control system to update data in real time.
[0025] Ultrasonic transmission drive circuit, ...
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