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Fingerprint recognition module encapsulation structure and fingerprint recognition equipment

A fingerprint recognition module and packaging structure technology, applied in character and pattern recognition, instruments, electrical components, etc., can solve the problems affecting the appearance of the fingerprint recognition module, and achieve the effect of reducing the risk of glue overflow and avoiding glue pollution.

Inactive Publication Date: 2015-07-22
NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Based on this, it is necessary to provide a fingerprint recognition module packaging structure and a fingerprint recognition device that can effectively prevent glue overflow for the problem that affects the appearance of the fingerprint recognition module.

Method used

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  • Fingerprint recognition module encapsulation structure and fingerprint recognition equipment
  • Fingerprint recognition module encapsulation structure and fingerprint recognition equipment
  • Fingerprint recognition module encapsulation structure and fingerprint recognition equipment

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Embodiment Construction

[0023] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and / or" includes any and all combinations of one or more of ...

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Abstract

The invention relates to a fingerprint recognition module encapsulation structure and fingerprint recognition equipment. The fingerprint recognition module encapsulation structure comprises a chip, a substrate and a base ring, wherein the chip comprises a top surface, a bottom surface and a first matching surface connecting the top surface and the bottom surface; the bottom surface of the chip is connected with the substrate through conductive materials; the face, connected with the chip, of the substrate comprises a second matching surface; the first matching face or / and the second matching surface is provided a plurality of faces; the base ring is provided with a plurality faces matched with first matching surface and the second matching surface; the base ring is matched with the first matching surface of the chip and the second matching surface of the substrate through glue. By the arrangement, the fingerprint recognition module encapsulation structure has the advantages that risk of glue overflowing can be effectively lowered when the base ring is connected with the chip and the substrate through the glue, and appearance cannot be affected by the glue overflowing.

Description

technical field [0001] The invention relates to the field of fingerprint identification module packaging, in particular to a fingerprint identification module packaging structure and fingerprint identification equipment including the fingerprint identification module. Background technique [0002] The fingerprint recognition system is a typical pattern recognition system, including modules such as fingerprint image acquisition, processing, feature extraction and comparison. Fingerprint recognition technology is widely used, such as access control, attendance system, notebook computer, mobile phone, automobile, bank payment can all apply fingerprint recognition technology. Please refer to figure 1 , the traditional fingerprint recognition module package structure includes a chip 110 , a substrate 120 and a base ring 130 . The chip 110 is connected to the substrate 120, and the base ring 130 is connected to the substrate 120 through glue 140; the base ring 130 has a first pl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/13H01L23/16H01L23/31G06K9/00
Inventor 刘伟陈宏伟
Owner NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
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