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Differential coplanar transmission line package pin internal and external cascade structure

A coplanar transmission line and cascaded structure technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems affecting signal transmission quality and transmission channel impedance discontinuity, so as to improve transmission quality and reduce impedance discontinuity Effect

Active Publication Date: 2017-06-27
NANTONG UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But from the perspective of signal transmission quality, right angles and irregular bends will increase the impedance discontinuity on the entire transmission channel, forming multiple reflections of the signal and affecting the transmission quality of the signal

Method used

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  • Differential coplanar transmission line package pin internal and external cascade structure
  • Differential coplanar transmission line package pin internal and external cascade structure
  • Differential coplanar transmission line package pin internal and external cascade structure

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Embodiment Construction

[0044] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0045] Such as image 3 , 4 As shown, the present invention provides a differential coplanar transmission line package pin internal and external cascade structure, including the carrier table 4, the frame pins distributed in the outer circumference of the carrier table 4, and the packaging of the carrier table 4 and part of the frame pins Body 3.

[0046] Wherein, the frame pin includes a differential coplanar transmission line, and the differential coplanar transmission line includes two center conductors arranged side by side and return paths 6 located on both sides of the two center conductors; used to provide a complete signal return path and reduce parasitic inductance.

[0047] The central conductor includes the internal pin 2 of the signal line package packaged inside the package body 3 and the external pin 1 of the signal li...

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Abstract

The invention provides a cascaded structure inside and outside the packaging pins of the differential coplanar transmission line, which includes a loading table, frame pins and packaging bodies distributed in the peripheral direction of the loading table. Wherein, the frame pin includes a differential coplanar transmission line, and the differential coplanar transmission line includes two center conductors arranged side by side and return paths located on both sides of the two center conductors; the center conductor includes signal lines packaged inside the package. The external pins of the signal line package located outside the package; the lateral dimensions of the internal pins of the signal line package are different from those of the external pins of the signal line package. The impedance discontinuity defect caused by the entire transmission channel.

Description

technical field [0001] The invention relates to the field of square flat packaging, in particular to a lead frame structure in the field of high-frequency / high-speed packaging. Background technique [0002] Quad Flat Package (QFP: Quad Flat Package), as a high-density pin, uses low-cost plastic packaging technology, the distance between the pins is very small, the pins are very thin, and it has a large area of ​​the carrier The platform is mainly used to complete large-scale or very large-scale integrated circuit packaging. With the development of modern electronic products in the direction of high frequency and high speed, more and more signals are in differential form, using differential pairs to transmit higher performance signals. Due to the complex internal structure and high design density of the existing QFP pins, when transmitting high-performance differential signals, the parasitic effects are obvious, and in severe cases, the transmission performance will be deter...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L23/31
Inventor 孙海燕孙玲杨玲玲刘炎华王智锋王雪敏
Owner NANTONG UNIVERSITY
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