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Fluorescent powder applying device for LED chip packaging

A technology of LED chip and coating device, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of uneven distribution of LED chips, easy disappearance of static electricity of phosphor powder, etc., and achieve the effect of uniform distribution

Inactive Publication Date: 2015-08-05
矽光光电科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: when the phosphor powder is coated on the surface of the LED chip by the electric field method, the static electricity of the phosphor powder is easy to disappear, and the distribution on the upper surface and the side of the LED chip is uneven.

Method used

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  • Fluorescent powder applying device for LED chip packaging
  • Fluorescent powder applying device for LED chip packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The present invention requires the closed LED structure to be conventionally arranged, and the LED chip 1 is installed on the substrate 2, and the circuit layer 3 is also arranged on the substrate 2 at the same time, and the negative part on the circuit layer 3 is connected to the negative electrode of the LED chip 1.

[0018] The overall structure of the coating device is as follows figure 1 As shown in , the main body of the coating device includes a phosphor powder tank 4, the top of the phosphor powder tank 4 is provided with an agitator 12; The top plate 6 is connected with each other, openings 7 are opened on the side plate 5 and the top plate 6, and a slide cover 8 is sleeved on the outside of the side plate 5 and the top plate 6, and the side and top surfaces of the slide cover 8 are provided with outlets 13 , a sealing plug 11 is also provided under the top of the sliding cover 8, and the position of the sealing plug 11 corresponds to the opening position on th...

Embodiment 2

[0021] Such as figure 1 As shown, as an improvement to the above-mentioned device, in another embodiment, a heat insulating layer 10 is provided on the outside of the heating component 9 . The heat insulating layer 10 can prevent the silica gel in the phosphor powder tank 4 from being heated and cured.

Embodiment 3

[0023] Such as figure 1 As shown, a spring 16 is also provided on the pressing rod 15 , and a limit card 17 is also provided above the spring 16 , and the limit card 17 is fixed on the inner wall of the pipe body 14 . Due to the action of the spring 16, it can be ensured that after the coating device is lifted, the openings 7 on the side plate 5 and the top plate 6 are quickly closed to prevent waste of silica gel and fluorescent powder.

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Abstract

The invention relates to a fluorescent powder applying device for LED chip packaging, and belongs to the technical field of LED chip packaging. The technical problem to be solved in the invention is that static electricity of fluorescent powder is easy to disappear and the distribution of fluorescent powder on the upper surface and the side surfaces of an LED chip is not uniform when fluorescent powder is applied to the surface of the LED chip by an electric field method. According to the invention, a special applying device is designed. The device comprises a fluorescent powder tank, a pressing rod, a direct-current power source and other components. During fluorescent powder applying by the device, silicone fluorescent powder mixture in the fluorescent powder tank can flow onto an LED chip when the pressing rod presses a circuit board, and is under the action of an electric field. Thus, fluorescent powder with static electricity can quickly move to the surface of the chip, and the distribution of fluorescent powder on the side surfaces and the top surface of the chip is basically uniform.

Description

technical field [0001] The invention relates to a fluorescent powder coating device for LED chip packaging, belonging to the technical field of LED packaging. Background technique [0002] LED is a semiconductor light-emitting diode, which is a solid-state semiconductor device that can directly convert electricity into light. LED energy-saving lamp is a high-brightness white light-emitting diode light source, high luminous efficiency, low power consumption, long life, easy control, maintenance-free, safe and environmentally friendly; it is a new generation of solid cold light source. [0003] When LED is packaged, phosphor powder needs to be coated on the surface of the chip, but the traditional dispensing method is likely to cause uneven coverage of phosphor powder on the surface of the chip, and there will be a problem of phosphor waste. Patent CN102856473A discloses a technique of using an external electric field to move the phosphor to the chip and make the coverage eve...

Claims

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Application Information

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IPC IPC(8): H01L33/50
CPCH01L33/505H01L2933/0041
Inventor 潘小和
Owner 矽光光电科技(上海)有限公司