Dummy connection structure and method of liquid crystal polymer material flexible circuit board

Abstract

The invention relates to a false connection structure and method for a flexible circuit board made of a liquid crystal polymer material. The false connection structure comprises jig positioning positions and fixed burn dot positions which are correspondingly arranged on external layer circuit board units, an internal layer circuit board unit, and combined adhesive layers. Each jig positioning position is provided with a jig positioning hole, the jig positioning holes are correspondingly arranged in the external layer circuit board units, the internal layer circuit board unit, and the combined adhesive layers, the fixed burn dot positions on the external layer circuit board units and the internal layer circuit board unit are provided with burn dot holes where the copper layers are etched. The false connection method comprises that 1) preparing a flexible circuit board which needs false connection and a false connection jig; 2) arranging a stripper plate, the external layer circuit board units, the internal layer circuit board unit and the combined adhesive layers on a base plate, and covering a cover plate; and 3) using soldering iron burn dots to position the external layer circuit board units, the internal layer circuit board unit and the combined adhesive layers through second burn dot holes. According to the invention, the false connection problem of the flexible circuit board made of the liquid crystal polymer material can be solved, false connection problems such as layer offset and the like are reduced, and risks of laminating equipment are eliminated.

Description

technical field [0001] The present invention relates to a kind of dummy connection manufacturing of flexible circuit boards, in particular to a dummy connection structure and method suitable for flexible circuit boards using liquid crystal polymer materials. Background technique [0002] In the production process of the existing flexible circuit board, when the flexible circuit board needs to be falsely connected, the following method is usually adopted: the substrate layer and the combined adhesive layer to be falsely connected are fixed on the On the jig, and then apply a certain pressure at a certain temperature according to the required time, so as to achieve the purpose of false connection. During this process, only positioning holes (drilled or etched) are opened on each substrate layer and combined adhesive layer. When the false connection adopts the flexible circuit board of liquid crystal polymer material, this false connection method cannot realize the false conne...

AI Technical Summary

Problems solved by technology

When the flexible circuit board of liquid crystal polymer material is used for false connection, this false connection method cannot realize false connection.

However, if staples or PCB rivets are used to falsely connect flexible circuit boards, the efficiency is low and layer deviation is prone to occur, which will affect the flatness of the steel plate of the pressing machine and easily damage the auxiliary materials of the pressing machine

Therefore, for flexible circuit boards using liquid crystal polymer materials, there are difficulties in the false connection process