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Method for manufacturing large-size precise circuit board

A manufacturing method and circuit board technology, which is applied in the direction of multilayer circuit manufacturing, etc., can solve problems such as open circuits and insufficient line width in densely populated areas, and achieve the effects of accurate alignment, avoiding poor exposure, and avoiding misalignment

Active Publication Date: 2015-08-26
JIANGMEN SUNTAK CIRCUIT TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problems of insufficient line width and open circuits in the densely populated areas of the prior art in the production of large-scale precision circuit boards, and provides a method for producing circuit boards with a line spacing of less than 0.1 mm and a board length greater than 914 mm

Method used

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  • Method for manufacturing large-size precise circuit board
  • Method for manufacturing large-size precise circuit board
  • Method for manufacturing large-size precise circuit board

Examples

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Embodiment

[0021] refer to Figure 1-3 , this embodiment provides a method for manufacturing a large-scale precision circuit board, the length of the circuit board manufactured in this embodiment is 1000 mm, and the minimum line spacing is 0.1 mm.

[0022] The specific production steps are as follows:

[0023] (1) According to the circuit board production process in the prior art, the base material is cut to obtain the base plate for preparing each inner layer board. After the conventional pretreatment of the substrate, the inner layer circuit pattern is made on the substrate through the steps of applying wet film on the substrate, exposing, developing, etching, and stripping the film (negative film process), thereby making each inner layer board.

[0024] Inspect and evaluate the quality of each inner layer board through inner layer AOI.

[0025] (2) The browning treatment of the inner layer board is carried out by adopting the existing browning process of the inner layer board before...

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Abstract

The invention relates to the field of circuit board manufacture, specifically a method for manufacturing a large-size precise circuit board. The method employs a mode of two-time exposure, and avoids a problem that a line width of a formed circuit graph is reduced because a height difference at a jointing overlapping part of two films enables the attaching with a plate to be untight. The width of an overlapped region is set as 0.2 mm, and the circuit graph, corresponding to the overlapping region, on the second circuit film is enabled to be 0.05 mm greater than a to-be-manufactured circuit graph, thereby guaranteeing that circuit graphs which are formed in the overlapping region during the first exposure and the second exposure are accurately aligned, and avoiding problems that the exposure of a circuit graph in the overlapped region is poor and the alignment is deflected. The method not only can be used for manufacturing a precise circuit board with a line distance being less than 0.1 mm, but also can be used for manufacturing a circuit board with the length being greater than 914 mm.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for producing a large-scale precision circuit board. Background technique [0002] Circuit board, also known as circuit board or printed circuit board, referred to as PCB (Printed Circuit Board), is one of the important components of the electronics industry, a support for electronic components, and a carrier for electrical connections. With the continuous update of electronic product application technology and the improvement of functions, the design of circuit boards is becoming more and more precise, dense, high-performance and diversified, and the length of circuit boards is no longer limited to within 813mm. However, in the existing production of circuit boards, the maximum length of the film is 813 mm. If a circuit board with a length greater than 813 mm is to be produced, two films need to be spliced ​​together, and then directly exposed once to m...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/46
Inventor 胡志勇白会斌汪广明罗家伟
Owner JIANGMEN SUNTAK CIRCUIT TECH
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