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Monitoring method for particle defect

A particle and particle detection technology, which is applied in the direction of electrical components, circuits, semiconductor/solid-state device testing/measurement, etc., can solve the problems of low yield and inability to effectively monitor particle defects, so as to improve the yield, reduce the risk of product failure, Monitor overall performance

Active Publication Date: 2015-09-02
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to provide a monitoring method for particle defects, so as to solve the problem that the existing monitoring methods cannot effectively monitor particle defects, resulting in low yield

Method used

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  • Monitoring method for particle defect
  • Monitoring method for particle defect

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Embodiment Construction

[0029] The method for monitoring particle defects proposed by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0030] Please refer to figure 2 , which is a flowchart of a method for monitoring particle defects according to an embodiment of the present invention. like figure 2 As shown, the monitoring method of the particle defect includes:

[0031] Step 1: Provide a light sheet;

[0032] Step 2: Coating a photoresist (PR for short) on the optical sheet to form a monitoring chip;

[0033] Step 3: Perform the first particle detection on the monitoring chip to obtain...

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Abstract

The invention provides a monitoring method for a particle defect. According to the method, photoresistance is formed on an optical plate to detect a surface scratch caused by a particle, so that monitoring of the particle defect becomes comprehensive. Moreover, on the basis of data statistics of the particle defect, a monitoring range of the particle defect is set in process equipment, thereby reducing a product badness risk caused by the particle defect. The monitoring method is simple and effective; and the yield is improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to a method for monitoring particle defects. Background technique [0002] Particle defect (PD for short) is an important factor affecting the yield in the integrated circuit manufacturing process, and the particle defect will lead to defective products, thus consuming a large amount of production costs. Therefore, effective control of particle defects is required in the production process. Particle defects, including fall on PD or surface scratches caused by particles, will adversely affect subsequent devices, thereby affecting yield. In particular, surface scratches are very common in the manufacturing process and have a great impact on product yield. [0003] At present, the method of monitoring particle defects is usually to place a bare wafer (Bare Wafer) in a process equipment and simulate the process state, and perform particle detection on the ligh...

Claims

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Application Information

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IPC IPC(8): H01L21/66
CPCH01L22/10H01L22/12H01L22/20H01L22/30
Inventor 国子明郭国超张凌越李楠
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP