Unlock instant, AI-driven research and patent intelligence for your innovation.

Method and device for detecting early failure of hardware

A technology of early failure and detection method, applied in the field of communication, can solve the problems of no solution, inability to detect early failure of hardware, time-consuming and other problems, and achieve the effect of reducing the scrap rate of chips

Inactive Publication Date: 2015-09-23
SEMICON MFG INT (SHANGHAI) CORP
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using this method will consume a lot of time, generally more than ten hours a week, to count a large amount of raw data of the quality system, to monitor the failure rate of hardware and to remind staff to take corresponding measures
[0004] It can be seen that at present, people only replace the hardware when the hardware reaches the survival time or when a large number of scrapped chips are generated; in the existing quality engineering, the method of manually counting the scrapped information through a large amount of advanced time cannot detect the early failure of the hardware
[0005] Aiming at the problem of a large number of chips being scrapped due to the inability to detect early hardware failures in related technologies, no effective solution has yet been proposed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for detecting early failure of hardware
  • Method and device for detecting early failure of hardware
  • Method and device for detecting early failure of hardware

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0027] The steps shown in the flow diagrams of the figures may be implemented in a computer system, such as a set of computer-executable instructions, and, although a logical order is shown in the flow diagrams, in some cases, may be executed differently from this The steps shown or described are performed in the order shown or described.

[0028] This embodiment provides a hardware early fault detection method, figure 1 is a schematic flowchart of a hardware early fault detection method according to an embodiment of the present invention, such as figure 1 As shown, the process includes the following steps:

[0029] Step S102, obtaining the raw data of the wafer processed by the wafer proces...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method and a device for detecting an early failure of a hardware, wherein the method comprises the steps of acquiring original data in processing a wafer by a wafer processing machine tool; performing statistics on predetermined event information of the wafer processing machine tool according to the original data, wherein the predetermined event information comprises the type of the predetermined event and occurrence frequency of the predetermined event; and according to the predetermined event information, determining the early fault condition, which corresponds with the type, of the hardware in the wafer processing machine tool. Through the method and the device of the invention, a problem of large-amount wafer discarding caused by incapability of detecting the early failure of hardware in related technology is settled. The invention provides the method for detecting the early failure of the hardware and reduces rejection rate of the wafer.

Description

technical field [0001] The present invention relates to the communication field, in particular to a hardware early fault detection method and device. Background technique [0002] At present, the scrapping of chips mainly comes from the aging of hardware components. For example, in 2012, 3046 chips were scrapped due to hardware components in a certain factory, accounting for 63% of the total number of scrapped chips that year. [0003] The main cause of hardware component aging is early failure issues, such as low quality of components, damage or aging before reaching the lifetime, etc. In the related art, after a large number of impacts lead to wafer scrapping, the corresponding modules are triggered to take measures to replace the components. Using this method will consume a lot of time, generally more than ten hours per week, to collect a large amount of raw data of the quality system, to monitor the failure rate of hardware and to remind staff to take corresponding meas...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G05B19/406
CPCG05B19/406G05B2219/34294
Inventor 余志贤刘立闫卫卫
Owner SEMICON MFG INT (SHANGHAI) CORP