Integrated circuit chip feeding device
An integrated circuit and chip technology, which is applied in the field of integrated circuit chip feeding devices, can solve the problem of a single feeding device, achieve the effect of less mutual interference and reduce maintenance costs
Inactive Publication Date: 2015-09-30
江苏求是缘半导体有限公司
View PDF5 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] The purpose of the present invention is to overcome the single defect of the traditional integrated circuit chip feeding device and provide a feeding device that can share anodes for two semiconductor devices
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0015] The present invention will be described in more detail below in conjunction with the accompanying drawings.
[0016] as attached figure 1 , 2 As shown in , the loading unit 1 is composed of the left loading platform 2, the right loading platform 4, the first pin 5, the second pin 6, and the third pin 7, and there are pin ribs 8 connected between the three pins . The left loading platform 2 is electrically connected to the first pin 5, and the right loading platform 4 is electrically connected to the third pin 7; the two loading platforms can respectively load a diode chip, the first pin 5 and the third pin 7 They can be used as cathodes of the diode chips loaded separately, and the second pin 6 can be used as a common anode of the two diode chips.
[0017] There is a 1mm wide feeding platform gap 3 between the left loading platform 2 and the right loading platform 4, and the plane where the two feeding platforms are located is lower than pins 5, 6, 7 and pin ribs 8 ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides an integrated circuit chip feeding device which is formed by parallelly connecting multiple feeding units. Each feeding unit is composed of a feeding platform, a first pin, a second pin and a third pin, each feeding platform comprises a left feeding platform and a right feeding platform, each left feeding platform is electrically connected with the corresponding first pin, each right feeding platform is electrically connected with the corresponding third pin, each first pin and the corresponding second pin can be used as cathodes of semiconductor devices for feeding respectively, and each second pin can be used as a shared anode of the two corresponding semiconductor devices. Pin ribs are connected among each three corresponding pins and the feeding units, and a plane where each feeding platform is positioned is lower than a plane where the corresponding pins and the corresponding pin ribs are positioned by 1-5mm. Each anode shared by the two corresponding semiconductor devices can be realized; different from a conventional feeding mode of cathode sharing, the integrated circuit chip feeding device meets special feeding requirements of different semiconductor devices, and mutual interference between main bodies of each two corresponding semiconductor devices is small.
Description
technical field [0001] The invention relates to the field of semiconductor testing, in particular to an integrated circuit chip loading device. Background technique [0002] In the mass production of semiconductor devices, in order to facilitate the counting, transfer and storage of semiconductor devices, semiconductor devices after packaging, marking or testing are often stored in special material tubes; due to the large number of semiconductor devices, semiconductor devices are placed in The workload of the material pipe is very large; the efficiency of manually placing semiconductor devices into the material pipe is low and it is not conducive to the assembly of a semiconductor device assembly line; therefore, designing an integrated circuit chip loading device has become an urgent problem to be solved. Contents of the invention [0003] The purpose of the present invention is to overcome the single defect of the traditional integrated circuit chip feeding device and pr...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66
CPCH01L22/20
Inventor 刘振华殷国海
Owner 江苏求是缘半导体有限公司