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An intelligent micro-channel cooling device for chargers

A cooling device and micro-channel technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of inability to cool and dissipate heat, damage the power characteristics of equipment, and uneven temperature field on the surface of the radiator, so as to achieve simple and convenient control and improve Effect of local convective heat transfer coefficient and heat transfer area, protection power characteristics

Active Publication Date: 2017-08-04
STATE GRID CORP OF CHINA +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in practical applications, the micro-channel makes the temperature field on the surface of the radiator extremely uneven, and it is impossible to conduct targeted cooling and heat dissipation for the concentrated heat-generating parts, and it is easy to damage the electrical characteristics of the equipment.

Method used

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  • An intelligent micro-channel cooling device for chargers
  • An intelligent micro-channel cooling device for chargers
  • An intelligent micro-channel cooling device for chargers

Examples

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Embodiment Construction

[0018] Below in conjunction with accompanying drawing and specific embodiment, further illustrate the present invention, should be understood that these embodiments are only for illustrating the present invention and are not intended to limit the scope of the present invention, after having read the present invention, those skilled in the art will understand various aspects of the present invention Modifications in equivalent forms all fall within the scope defined by the appended claims of this application.

[0019] Such as Figure 1 to Figure 4 As shown, the present invention discloses an intelligent micro-channel cooling device for a charger, comprising a lower plate 1 , an upper plate 2 bonded to the lower plate 1 , and a cover plate 3 . The upper plate 2 and the lower plate 1 are connected by four pins. . The side of the lower plate 1 facing the upper plate 2 is provided with several circles of lower annular flow channels laid from the inside to the outside and several ...

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Abstract

The invention provides an intelligent microchannel cooling device for a charger, which includes an upper plate, a lower plate, a cover plate, and a temperature sensor; the upper plate and the lower plate are respectively provided with a water flow channel and a water outlet pipe installation groove. The upper board includes a water inlet pipe; the wall of the water inlet pipe is provided with a sealing groove; the inside of the cover board encapsulates a circuit board and is fixed on the upper board with pins. The invention better solves the heat dissipation problem of the central part, has high reliability, and is easy to control. The heat dissipation device can be directly attached to the chip board of the charger, and the insertion and removal are fast and convenient.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation for integrated chips, and in particular relates to an intelligent microchannel heat dissipation device for integrated chips. Background technique [0002] With the continuous development of computer technology, the volume of electronic equipment is getting smaller and smaller, but the power and integration are greatly improved. The generation of high heat flux has become an irresistible trend, so the cooling problem of electronic equipment is becoming more and more serious. protrude. Statistics show that at present, 55% of electronic chip failure problems are caused by overheating, so research on effective and feasible electronic chip cooling devices has become an urgent problem. [0003] Micro-channel liquid cooling is to directly attach the water-cooling plate to the surface of the heat dissipation module, and take away the heat through the forced convection of the liquid in the water-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/427
Inventor 张卫国陈良亮刘华锋石进永林弘宇李香龙刘秀兰曾爽邓超杨凤坤张宁唐雾婺李捷
Owner STATE GRID CORP OF CHINA
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