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A Memory Solder Joint Realizing the Interconnection of 3D Packaged Chips

A technology of chip loading and memory, applied in the field of three-dimensional packaging of electronic devices, to achieve high service life and meet the effect of high reliability requirements

Active Publication Date: 2018-11-16
福建紫金英菲迅应用材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the industry still lacks high-reliability interconnection solder joints that can realize the stacking interconnection of 3D packaged chips, and relevant research is urgently needed

Method used

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  • A Memory Solder Joint Realizing the Interconnection of 3D Packaged Chips
  • A Memory Solder Joint Realizing the Interconnection of 3D Packaged Chips
  • A Memory Solder Joint Realizing the Interconnection of 3D Packaged Chips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] The solder paste containing submicron memory particles for 3D packaging chip interconnection, the content of submicron memory particles is 10%, and the balance is Sn. Mix rosin resin, thixotropic agent, stabilizer, active auxiliary agent and active agent to prepare solder paste.

[0017] The service life of the memory solder joint formed after bonding (235°C, 9MPa) is about 2500 thermal cycles (considering the experimental error), and the solder paste has excellent solderability.

Embodiment 2

[0019] The solder paste containing submicron memory particles for 3D packaging chip interconnection, the content of submicron memory particles is 12%, and the balance is Sn. Mix rosin resin, thixotropic agent, stabilizer, active auxiliary agent and active agent to prepare solder paste.

[0020] The service life of the memory solder joint formed after bonding (255°C, 5MPa) is about 2850 thermal cycles (considering the experimental error), and the solder paste has excellent solderability.

Embodiment 3

[0022] The solder paste containing submicron memory particles for 3D packaging chip interconnection, the content of submicron memory particles is 14%, and the balance is Sn. Mix rosin resin, thixotropic agent, stabilizer, active auxiliary agent and active agent to prepare solder paste.

[0023] The service life of the memory solder joint formed after bonding (245°C, 10MPa) is about 3000 thermal cycles (considering the experimental error), and the solder paste has excellent solderability.

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Abstract

The present invention discloses a memory solder joint realizing interconnection of 3D packaging chips and belongs to the field of three-dimensional packaging of electronic devices. The memory solder joint is prepared by the following steps: preparing pasty memory-alloy-particle-containing solder paste by using marketed Sn powder, mixed rosin resin, a thixotropic agent, a stabilizer, an activity adjuvant, an active agent and submicron CuZnAl memory alloy particles; preparing salient points on the surfaces of the chips by adopting the precision screen printing and reflow processes; and realizing vertical stacking interconnection of the chips at a certain pressure (5-10Mpa) and at the temperature (235-255 DEG C).

Description

technical field [0001] The invention relates to a memory solder joint for realizing the interconnection of 3D packaging chips, which belongs to the field of three-dimensional packaging of electronic devices, and is an interconnect solder joint with high performance. The memory solder joints are mainly used for high-reliability interconnection solder joints in vertically stacked chips. Background technique [0002] Three-dimensional (3D) packaging technology continues the application of Moore's Law and has become an important research topic in the electronics industry. 3D packaging is known as a new generation of packaging technology. The development of this technology directly shifts electronic packaging from the 2D plane of the chip to the 3D space, and the vertical stacking interconnection technology between chips has also become an important research topic in the 3D space. [0003] In order to realize the vertical stacking interconnection of chips, the industry proposes ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L21/60
Inventor 张亮孙磊郭永环
Owner 福建紫金英菲迅应用材料有限公司