40results about How to "Meet the needs of high reliability" patented technology

The invention discloses a data disaster tolerant system which is applicable to a wide area network, pertains to the technical filed of computer information storage and solves the problem that the current data disaster tolerant system does not take the effect of data transmission links and the need of lots of redundant data storage space in the wide area network into consideration. The system of the invention comprises M local storage clients connected to the wide area network and N storage servers in different geographical positions; every local storage client consists of a web manager, a snap module, a mapping file redundant array module, a compression module, a decompression module, an encryption module, a decryption module, a backup distribution module and a recovery and integration module; the storage server consists of a failure detection module, a distributed arbitration module, a recovery module, a distributed copy service module, a backup and recovery service module. The system of the invention combines disaster tolerant coding and copying, reduces the amount of redundant data and effectively utilizes storage space. Meanwhile, data to be transmitted is compressed and encrypted, thus improving the safety and reliability of data on network transmission, effectively utilizing network bandwidth and reaching excellent disaster tolerant effect.

The invention relates to a resource allocation method for a low-delay high-reliability service in mobile edge computing, and belongs to the technical field of mobile communication. According to the method, in a multi-MEC multi-user environment, a user task queue model and an MEC task queue model are described respectively, a theoretical model of mobile service provider network utility maximizationis established with the task queue overflow probability as the constraint, and joint allocation is performed on power resources, bandwidth resources and computing resources. Considering that a constraint condition in the optimization model comprises a limit constraint of a task queue overflow probability; a random optimization problem of time averaging is converted and decomposed into three sub-problems of single-time-slot solving through a Lyapunov optimization theory, including calculation resource allocation of users, bandwidth and power allocation and calculation resource allocation of MEC, and then the three sub-problems are solved respectively. According to the method, the average total income of the MSP is improved while the requirements of users for low time delay and high reliability are met.

The invention discloses a networking method for a ring network of a packet transport network. The method comprises the following steps: enabling a three-layer IP route forwarding function at a convergence layer site of the PTN, and dividing other access layer sites to different access rings according to the rings, wherein the access layer sites are positioned in the same two-layer switching network. The method of the invention avoids a loop circuit on the ring network of the PTN, meanwhile meets the requirement of the network management function of the PTN and the requirement of high reliability of services, and simultaneously can meet the requirement for protecting the quick switching function of the TMPLS service from being affected by STP convergence.

The application discloses a method and a device for processing data flow in a distributed link aggregation network. The method comprises the following steps: after receiving a unicast message, determining the outbound interface of the unicast message according to an MAC (Media Access Control) forwarding table; if determining that the outbound interface of the unicast message is a specific port, redirecting the unicast message to a preset specific layer-2 multicast group table according to preset ACL (Access Control List) rules, and forwarding the unicast message according to the outbound interface list of the specific layer-2 multicast group table; wherein when only one first DT (Distributed Trunking) port on the equipment belongs to the DT port of a distributed aggregation group, the first DT port is defined as the specific port, and the outbound interface list only comprises the first DT port; when at least two DT ports on the equipment belong to the distributed aggregation group, the specific port is a local aggregation group consisting of the at least two DT ports, and the outbound interface list comprises the at least two DT ports; when the specific port is changed into a DOWN state, the outbound interface list of the specific layer-2 multicast group table is changed into an ISC (Inter-Switch Communication) port, which is connected with an ISC link, on the equipment.

The embodiment of the invention discloses a system for sharing files licensed by wireless network, which comprises a first controller and a second controller. The first controller and the second controller as well as partial or all controllers form a controller resource pool. The first controller is allocated with first controller license files and backup license files. When the second controller has failure, all or partial main attribution base stations of the first controller and the second controller establish new main attribution connection and start the allocated first controller license files and the backup license files at the same time to provide service. The embodiment of the invention further discloses a method for sharing the files licensed by the wireless network and controllers thereof. In addition, the proposal provided by the embodiment of the invention can avoid capacity loss when the network goes wrong, thus improving the reliability of network, increasing utilization rate and the ability of resisting burst flow rate of equipment resources, lowering the cost and meeting high reliable requirements of operators.

The invention discloses a lead-free nanometer solder containing Yb, A1 and B, and belongs to the field of lead-free solders for microelectronic assembly. The lead-free solder comprises 0.5-4.5% of Ag, 0.2-1.5% of Cu, 0.01-0.5% of Yb, 0.01-0.5% of A1, 0.01-0.5% of B, and the balance being Sn. The preparation method for the lead-free nanometer solder includes the steps of preparing Sn ingot, intermediate alloy of Sn-Cu, intermediate alloy of Sn-Ag, intermediate alloy of Sn-Yb, intermediate alloy of Sn-A1, and intermediate alloy of Sn-B which are commercially available, smelting the lead-free solder by means of the manufacturing process of high-energy and ultrasonic stirring based on ratio requirements, smelting and casting the lead-free solder into a bar under the protection atmosphere of an inert gas so as to prevent burning loss of the elements, make the bar into an electrode, and finally prepare the lead-free nanometer solder particles by a DC (direct current) electric arc method of consumable electrodes. The lead-free nanometer solder containing Yb, A1 and B has the advantages of good wettability and mechanical properties, and capability of meeting the needs of the electronics industry.

The present invention discloses a memory solder joint realizing interconnection of 3D packaging chips and belongs to the field of three-dimensional packaging of electronic devices. The memory solder joint is prepared by the following steps: preparing pasty memory-alloy-particle-containing solder paste by using marketed Sn powder, mixed rosin resin, a thixotropic agent, a stabilizer, an activity adjuvant, an active agent and submicron CuZnAl memory alloy particles; preparing salient points on the surfaces of the chips by adopting the precision screen printing and reflow processes; and realizing vertical stacking interconnection of the chips at a certain pressure (5-10Mpa) and at the temperature (235-255 DEG C).

The invention relates to a dual-purpose detonating device for detonating a perforating gun, which is characterized by comprising an upper body, a piston component, a lower body and a detonating component, wherein the upper body and the lower body are fixedly connected through screws; the piston component and the detonating component are sequentially arranged in a through hole; a nailhead end of a ramming piston of the piston component is arranged in the upper body and in the through hole matched with the nailhead end, and the nail point end thereof is arranged in a axle center through hole of a pin striking seat of the detonating component; three steps are arranged in the through hole formed by the upper body and the lower body; a pressure piston sleeve is clamped between two middle steps; the width of each step is equal to the thickness of the pressure piston sleeve; and the detonating component is connected with the step at the bottom of the lower body. The detonating device provided by the invention, which is suitable for tubing conveyed perforating operation of an oil and gas well, has the advantages of compact structure, complete assembly, and reliable function, has two-path detonating functions of rod throwing and pressurizing, and integrates the efficacy of striking detonating and wellhead pressurizing detonating.

The invention discloses an interconnection material containing Yb and namometer Cu and formed by stacking of 3D chips, and belongs to the field of chip interconnection materials. In the interconnection material, the content of the rare earth element Yb is 0.01-0.5%, the content of nanometer Cu particles is 1-5%, and the remaining is In. Firstly, In-Yb intermediate alloy powder is prepared; secondly, the In-Yb powder, In powder, mixed rosin resin, a thixotropic agent, a stabilizing agent, an activity adjuvant and an activator are mixed and are fully stirred; and finally, the nanometer Cu particles are added, the paste interconnection material containing Yb and the nanometer Cu particles are fully stirred, precise screen printing and reflow welding technologies are adopted to prepare protruding points on the surfaces of chips, vertical interconnection of the chips in three-dimensional space is realized under certain pressure (1MPa-10Mpa) and temperature (170-260 DEG C) conditions, and high-intensity interconnection welding points are formed. The interconnection material is high in reliability and can be used for vertical packaging of chips packaged in three dimensions.

The invention provides an electrothermal magnetic isolation multiphase fault-tolerant motor, which comprises a stator, a rotor, a shell, an end cover, a rotary transformer and a bearing, wherein the stator comprises a motor shell and a stator iron core, the stator iron core comprises five modules in total, a phase winding is wound on each module, each module comprises two large teeth and two smallteeth, the winding coil is wound on the two large teeth, the two small teeth are used for magnetic isolation, the outer sides of the two small teeth are coated with heat insulation glue, after the stator modules are assembled, weak thermal coupling of each phase winding is realized, the heat of each phase winding is dissipated to the shell body, the motor rotor comprises a motor shaft and the like, the motor bearings are installed on the two sides of the motor shaft, the rotary transformer is coaxially installed at one end of the motor shaft to detect the position of the motor rotor, the stator iron core is installed inside the motor shell, the end cover of the motor is divided into a front end cover and a rear end cover, the front end cover is in interference fit with one end of the motor shell in the radial direction, the front end cover is axially limited through a spigot end face on the inner wall of the motor shell, and the rear end cover is installed at the other end of the shell.

The invention discloses a Sn-based interconnection material for three-dimension packaging chip stacking, and belongs to the field of chip interconnection materials. The interconnection material comprises 5-8% of graphene nanoparticles and 6-10% of SiC nanowires, with the balance being Sn. Commercially available Sn powder, mixed rosin resin, thixotropic agent, stabilizer, active assistant agent and activator are fully mixed; then, graphene nanoparticles are added; and finally, SiC nanowires are added, and the materials are fully mixed to prepare a paste-like interconnection material containing graphene nanoparticles and SiC nanowires. Bumps are prepared on the surfaces of chips by a printing method, vertical chip stacking and interconnection is realized at certain pressure (1-10MPa) and temperature (235-260 DEG C), and 'reinforced concrete' solder joints are formed. The interconnection material of the invention has high reliability, and can be used for three-dimension packaging chip stacking.

The invention discloses a 3D packaging structure for a mass memory circuit, and belongs to the technical field of electronic product packaging. The structure comprises memory chips, an adhesive, bonding wires, a substrate, and a housing. The structure comprises a plurality of memory chips, and the memory chips form a 3D chip group in a vertically staggered and stacked manner, wherein the memory chips are bonded through the adhesive. The 3D chip group is bonded on the substrate through the adhesive, and the substrate is fixed on the housing through the adhesive. The bonding wires are used for forming the electrical connection between the 3D chip group and the substrate, between the 3D chip group and the housing, and between the memory chips. According to the invention, the chips are arranged in the vertically staggered and stacked manner, thereby enlarging the capacity and meeting the high-reliability of a memory product in domestic cutting-edge industries.

The invention discloses Sn-based brazing filler metal capable of achieving vertical stacking of chips and a bonding method of the Sn-based brazing filler metal. The Sn-based brazing filler metal comprises aluminum oxide nanofibers, nano palladium particles, Bi and Sn. The coupling effect of the aluminum oxide nanofibers, the nano palladium particles, Bi and Sn is utilized for strengthening welding spots, Bi-rich and IMC crystal grains can be tightly wound together by adding the aluminum oxide nanofibers, the nano palladium particles can be gathered at the grain boundaries of the Bi-rich and IMC crystal grains, the effect of pinning the aluminum oxide nanofibers and the grain boundaries is achieved, the aluminum oxide nanofibers and the nano palladium particles are coupled to reinforce the welding spots, so that the welding spots still keep higher strength and longer service life during the service period; the Sn-based brazing filler metal has good wettability and higher welding spot mechanical property, can meet the high reliability requirement of vertical stacking of high-density packaging and three-dimensional packaging electronic device chips, and can be used for wave soldering, reflow soldering and other brazing methods.

The invention relates to the technical field of breaker control circuits, and particularly relates to a self-restoring over/under voltage breaker controller circuit. The circuit ensures that sufficient energy can be provided to a motor to drive a breaker to release by additionally providing an energy storage circuit when a main circuit is in under voltage or voltage loss and the delay time is out;a redundant clock circuit is adopted to ensure that a backup clock is immediately started under the circumstance that the main clock of a system is failed, and the system can be more stable and reliable; and the whole circuit has simple design, high electromagnetic compatibility resistance and low working temperature, can meet the requirement of high reliability, and is suitable for the actual requirement for small special volume and small circuit board storage space of a self-restoring over/under voltage small breaker.