Supercharge Your Innovation With Domain-Expert AI Agents!

Memory solder joint realizing interconnection of 3D packaging chips

A technology for chip mounting and memory, applied in the field of three-dimensional packaging of electronic devices, to achieve the effect of high service life and high reliability requirements

Active Publication Date: 2015-10-14
XUZHOU NORMAL UNIVERSITY
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the industry still lacks high-reliability interconnection solder joints that can realize the stacking interconnection of 3D packaged chips, and relevant research is urgently needed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Memory solder joint realizing interconnection of 3D packaging chips
  • Memory solder joint realizing interconnection of 3D packaging chips
  • Memory solder joint realizing interconnection of 3D packaging chips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] The solder paste containing submicron memory particles used for interconnection of 3D packaged chips has a submicron memory particle content of 10%, and the balance is Sn. Mix rosin resin, thixotropic agent, stabilizer, active auxiliary and active agent to prepare solder paste.

[0017] The service life of the memory solder joint formed after bonding (235℃, 9MPa) is about 2500 thermal cycles (taking into account the test error), and the solder paste has excellent solderability.

Embodiment 2

[0019] The solder paste containing sub-micron memory particles used for interconnection of 3D packaged chips has a sub-micron memory particle content of 12%, and the balance is Sn. Mix rosin resin, thixotropic agent, stabilizer, active auxiliary and active agent to prepare solder paste.

[0020] The service life of the memory solder joint formed after bonding (255℃, 5MPa) is about 2850 thermal cycles (taking into account the test error), and the solder paste has excellent solderability.

Embodiment 3

[0022] The solder paste containing sub-micron memory particles used for interconnection of 3D packaged chips has a sub-micron memory particle content of 14%, and the balance is Sn. Mix rosin resin, thixotropic agent, stabilizer, active auxiliary and active agent to prepare solder paste.

[0023] The service life of the memory solder joint formed after bonding (245℃, 10MPa) is about 3000 thermal cycles (taking into account the test error), and the solder paste has excellent solderability.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses a memory solder joint realizing interconnection of 3D packaging chips and belongs to the field of three-dimensional packaging of electronic devices. The memory solder joint is prepared by the following steps: preparing pasty memory-alloy-particle-containing solder paste by using marketed Sn powder, mixed rosin resin, a thixotropic agent, a stabilizer, an activity adjuvant, an active agent and submicron CuZnAl memory alloy particles; preparing salient points on the surfaces of the chips by adopting the precision screen printing and reflow processes; and realizing vertical stacking interconnection of the chips at a certain pressure (5-10Mpa) and at the temperature (235-255 DEG C).

Description

Technical field [0001] The invention relates to a memory solder joint for realizing the interconnection of a 3D packaged chip, belonging to the field of three-dimensional packaging of electronic devices, and a high-performance interconnect solder joint. The memory solder joints are mainly used for high-reliability interconnection solder joints for chip vertical stacking. Background technique [0002] Three-dimensional (3D) packaging technology continues the application of Moore's Law and has become an important research topic in the electronics industry. 3D packaging is known as a new generation of packaging technology. The development of this technology has directly turned electronic packaging from the 2D plane of the chip to the 3D space, and the vertical stacking interconnection technology between the chips has also become an important research topic in the 3D space. [0003] In order to achieve a vertical stack of interconnect chips, using the industry made solid - liquid inte...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/488H01L21/60
Inventor 张亮孙磊郭永环
Owner XUZHOU NORMAL UNIVERSITY
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com