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Roundness-bending forming device

A forming device and round-bending technology, which is applied in the field of mechanical processing, can solve problems such as irregular bending of solder rings, difficulty in meeting technical requirements, and prone to scratches on the surface, so as to reduce surface damage, smooth surface, and reasonable structure Effect

Inactive Publication Date: 2015-10-28
中国人民解放军第五七〇六工厂
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Workers first bend the solder bar with simple tools, and then pass it through the plastic mold to correct the circle. The solder ring made in this way is irregularly bent, and the surface is particularly prone to scratches, especially for small solder rings. Bending is time-consuming. Laborious and difficult to meet technical requirements

Method used

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Embodiment Construction

[0015] The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0016] A bending and forming device, which includes a support 3, two positioning pins 5, two bearings 4, a mandrel 2 and a mandrel drive mechanism, wherein two positioning pins 5 are fixed on the support 3, and two The bearings have the same size, and are respectively fixed on the positioning pin 5 through the inner ring of the bearing. The outer circumferential surfaces of the two bearing outer rings are adjacent and do not touch (to ensure no friction, the distance is 0.01 ~ 0.1mm); one end of the mandrel 2 is fixed Connected to the drive mechanism of the mandrel, a horizontal gap is formed between the other end and the surface of the support 3, and the axis of the mandrel 2 is located on the perpendicular line of the line connecting the centers of the two bearings, and the outer circumference of the mandrel is in line with the outer surface of the bearin...

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Abstract

The invention discloses a roundness-bending forming device and belongs to the technical field of machining. The roundness-bending forming device is used for circular ring machining. The roundness-bending forming device comprises a support, a mandrel, a mandrel driving mechanism, two positioning pins and two bearings. The two positioning pins are fixed to the surface of the support. The two bearings are the same in size and are installed on the positioning pins respectively through inner rings of the bearings. The outer circumferential surfaces of outer rings of the two bearings are adjacent and are not in contact. One end of the mandrel is fixedly connected to the mandrel driving mechanism. A horizontal gap is formed between the other end of the mandrel and the surface of the support. The axis of the mandrel is located on the perpendicular bisector of the connecting line of centers of circles of the two bearings. The distance between the outer circumferential surface of the mandrel and the outer circumferential surfaces of the outer rings of the bearings is the thickness of a machined circular ring.

Description

technical field [0001] The invention belongs to the technical field of mechanical processing, and relates to a circle forming device, in particular to the circle forming of a solder ring with a small size. Background technique [0002] At present, the main production process of solder rings is punching and shearing, followed by manual bending and forming. Workers first bend the solder bar with simple tools, and then pass it through the plastic mold to correct the circle. The solder ring made in this way is irregularly bent, and the surface is particularly prone to scratches, especially for small solder rings. Bending is time-consuming. It is laborious and difficult to meet the technical requirements. Contents of the invention [0003] In view of this, the present invention provides a round forming device, which makes the round forming efficient and fast, and has high roundness without causing any damage to the surface of the ring. [0004] The purpose of the present inve...

Claims

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Application Information

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IPC IPC(8): B21D53/16
CPCB21D5/143B21D53/16
Inventor 张君张婧暄王宇晨杨超朱奎柱单彬
Owner 中国人民解放军第五七〇六工厂
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