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Image acquisition module with built-in dustproof structure

A technology for dust-proof structure and image capture, which is applied in the directions of image communication, components of color TV, components of TV system, etc., can solve the problem of not designing a better dust-proof structure and so on.

Active Publication Date: 2015-11-04
GUANGZHOU LUXVISIONS INNOVATION TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conventional imaging module does not design a better dust-proof structure

Method used

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  • Image acquisition module with built-in dustproof structure
  • Image acquisition module with built-in dustproof structure
  • Image acquisition module with built-in dustproof structure

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example 〕

[0019] see figure 1 and figure 2 shown, where figure 2 for figure 1 An enlarged schematic of part A. The first embodiment of the present invention provides an image capture module M with a built-in dustproof structure, which includes: an image sensing unit 1 , a frame case 2 and an actuator structure 3 .

[0020] First, if figure 1 As shown, the image sensing unit 1 includes a carrier substrate 10 and an image sensing chip 11 disposed on the carrier substrate 10 and electrically connected to the carrier substrate 10 . For example, the image sensing chip 11 can be a CMOS image sensing chip, and the image sensing chip 11 can be provided with an adhesive (not numbered, such as UV adhesive, thermosetting adhesive, or furnace curing adhesive, etc.) on the carrier substrate 10 . In addition, the carrier substrate 10 can be a circuit substrate with a plurality of conductive pads (not labeled) on the upper surface, the upper surface of the image sensing chip 11 has a plurality...

no. 2 example

[0029] see Figure 4 and Figure 5 shown, where Figure 5 for Figure 4 Schematic enlarged view of part B. The second embodiment of the present invention provides an image capture module M with a built-in dustproof structure, which includes: an image sensing unit 1 , a frame case 2 and an actuator structure 3 . Depend on Figure 4 and figure 1 comparison of, and Figure 5 and figure 2 It can be seen from the comparison that the biggest difference between the second embodiment of the present invention and the first embodiment is that: in the second embodiment, the second surrounding structure 310 has a 30 in the direction of the inner surrounding surface 3000 of the second surrounding extension 310A extending horizontally and a second surrounding blocking part 310B extending vertically downward from the second surrounding extending 310A, the second surrounding extending 310A is adjacent to The first surrounding blocking portion 300B is disposed above the first surround...

no. 3 example

[0033] see Figure 6 and Figure 7 shown, where Figure 7 for Figure 6 Schematic enlarged view of part C. The third embodiment of the present invention provides an image capture module M with a built-in dustproof structure, which includes: an image sensing unit 1 , a frame case 2 and an actuator structure 3 . Depend on Figure 6 and Figure 4 comparison of, and Figure 7 and Figure 5 It can be seen from the comparison that the biggest difference between the third embodiment of the present invention and the second embodiment is that in the third embodiment, the first surrounding structure 300 has an inner surrounding surface 3000 of the lens holder 30 toward the movable lens assembly. 31 to extend horizontally in the direction of the first surrounding extension 300A. The second surrounding structure 310 has a second surrounding extending portion 310A extending horizontally from the outer peripheral surface 3100 of the movable lens assembly 31 toward the inner surround...

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Abstract

Provided is an image acquisition module with a built-in dustproof structure, comprise an image sensing unit, a framework housing and an actuator structure. The image sensing unit comprises a bearing substrate and an image sensing wafer. The framework housing is arranged on the bearing substrate and encircles the image sensing wafer. The actuator structure is arranged on the framework housing and above the image sensing wafer, and comprises a lens holder arranged on the framework housing, and a movable lens module capable of being movably arranged in the lens holder. The internal surrounding surface of the lens holder is provided with a first surrounding structure, and the periphery of the movable lens module is provided with a second surrounding structure arranged above the first surrounding structure. The first surrounding structure of the lens holder is in cooperation with the second surrounding structure of the movable lens module so as to form a built-in dustproof structure.

Description

technical field [0001] The invention relates to an image capture module, especially an image capture module with a built-in dustproof structure. Background technique [0002] In recent years, it has become increasingly common for handheld devices such as mobile phones and PDAs to be equipped with imaging modules. With the market demand for better functions and smaller volumes of handheld devices in the product market, imaging modules have become Facing the dual requirements of higher image quality and miniaturization. For the improvement of the image quality of the imaging module, on the one hand, it is to increase the pixels. The market trend is from the original VGA level of 30 pixels to the common 2 million pixels, 5 million pixels, and 1300 pixels in the market. 10,000 pixels, and even higher levels of 41 million pixels or more have been introduced. In addition to the improvement of pixels, another concern is the clarity of image capture. Therefore, the image capture m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225
Inventor 彭国豪许博智
Owner GUANGZHOU LUXVISIONS INNOVATION TECH LTD
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