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Mobile terminal and method for dissipating heat of mobile terminal

A mobile terminal and heat technology, applied in the direction of cooling/ventilation/heating transformation, telephone structure, etc., can solve the problems of hot panel, poor heat dissipation effect of stainless steel, poor consumer experience, etc., and achieve the effect of reducing heat

Inactive Publication Date: 2015-11-11
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

The thinner the mobile phone, the more high-strength material is required for the middle frame or shell of the mobile phone, usually made of stainless steel, but the heat dissipation effect of stainless steel is not good, and because the thickness of the mobile phone is thin, the heat on the motherboard is easily transferred to Panel, make the panel hot, bring bad experience to consumers

Method used

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  • Mobile terminal and method for dissipating heat of mobile terminal
  • Mobile terminal and method for dissipating heat of mobile terminal
  • Mobile terminal and method for dissipating heat of mobile terminal

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Embodiment Construction

[0018] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0019] image 3 It is a schematic cross-sectional structural view of a mobile terminal provided by an embodiment of the present invention. Such as image 3 As shown, in this embodiment, the mobile terminal includes a main board 3 for installing a chip 5, a main board support member 2 and a rear case 4, and the rear case 4 is arranged on a side of the chip 5 away from the main board 3, A heat conduction layer 6 is provided between the chip 5 and the rear case 4 . By providing a heat conduction layer 6 between the chip 5 and the back shell 4, most of the heat of the mobile terminal can be transferred to the side away from the motherboard support member 2 through the heat conduction layer 6, that is, most of the heat is transferred to the back shell 4 to reduce heat dissipation. The heat transferred...

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Abstract

The invention discloses a mobile terminal. The mobile terminal comprises a mainboard for mounting a chip, a mainboard support member and a back shell, wherein the back shell is arranged on one side, which is far away from the mainboard, of the chip; and heat conducting layers are arranged between the chip and the back shell. The invention also discloses a method for dissipating heat of the mobile terminal. The heat conducting layers are arranged between the back shell and the chip, and heat is transferred towards the back shell through the heat conducting layers after the chip of the mobile terminal emits heat. According to the mobile terminal, the heat conducting layers are arranged between the chip and the back shell, so that most heat of the mobile terminal can be transferred towards one side which is far away from the mainboard support member through the heat conducting layers, namely, most heat is transferred and dissipated towards the back shell; and heat transferred onto the mainboard support member is reduced.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a mobile terminal and a method for dissipating heat from the mobile terminal. Background technique [0002] At present, mobile terminals such as mobile phones are becoming thinner and lighter in order to meet the needs of the market. However, mobile terminals such as thin and lightweight mobile phones face the problems of strength and heat dissipation. The thinner the mobile phone, the more high-strength material is required for the middle frame or shell of the mobile phone, usually made of stainless steel, but the heat dissipation effect of stainless steel is not good, and because the thickness of the mobile phone is thin, the heat on the motherboard is easily transferred to The panel makes the panel hot, which brings a bad experience to consumers. [0003] Therefore, in order to cope with the development of thin and lightweight mobile terminals, it is urgent to d...

Claims

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Application Information

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IPC IPC(8): H05K7/20H04M1/02
Inventor 李路路
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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