Semiconductor substrate, semiconductor package structure and manufacturing method thereof

Abstract

The invention relates to a semiconductor substrate, a semiconductor packaging structure and a manufacturing method thereof. The semiconductor substrate includes: a first patterned metal layer, a second patterned metal layer, a first dielectric layer, a second dielectric layer and a carrier layer. The second patterned metal layer is located under the first patterned metal layer. The first dielectric layer is located between the first patterned metal layer and the second patterned metal layer. The first dielectric layer includes at least one via hole. The at least one via extends from the first patterned metal layer to the second patterned metal layer. The at least one via electrically connects the first patterned metal layer to the second patterned metal layer. The second dielectric layer is adjacent to the first dielectric layer. The second dielectric layer covers the second patterned metal layer. The second dielectric layer has a plurality of first openings to expose the second patterned metal layer. The carrier layer is adjacent to the second dielectric layer and has a plurality of second openings. The location of each of the second openings substantially corresponds to the location of each of the first openings.

Description

technical field [0001] The invention relates to a semiconductor substrate, a semiconductor packaging structure and a manufacturing method thereof. Background technique [0002] Most semiconductor substrates use pre-pregnant composite fibers (Pre-pregnated composite fibers / Prepreg / P.P.) as the material of the dielectric layer. Since the main components of pre-impregnated synthetic fibers are resin and glass fibers, a relatively thick dielectric layer is required in the design to maintain the structural strength of the semiconductor substrate, thus increasing the thickness of the substrate. Contents of the invention [0003] One embodiment of the present invention relates to a semiconductor substrate. The semiconductor substrate includes a first patterned metal layer, a second patterned metal layer, a first dielectric layer, a second dielectric layer and a carrier layer. The second patterned metal layer is located under the first patterned metal layer. The first dielectri...

AI Technical Summary

Problems solved by technology

Since the main components of pre-impregnated synthetic fibers are resin and glass fibers, a relatively thick dielectric layer is required in the design to maintain the structural strength of the semiconductor substrate, and thus increase the thickness of the substrate

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