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Method, device and system for measuring thickness of conformal coating film

A measurement method and a technology of a measurement device, applied in the direction of measurement devices, optical devices, instruments, etc., can solve the problems that it is difficult to find a continuous copper skin and cannot truly reflect the thickness of the entire plane conformal coating film of the product.

Active Publication Date: 2017-10-24
BEIJING JINGWEI HIRAIN TECH CO INC
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Problems solved by technology

The above method has certain space layout requirements for the product, for example, it is required to have 9mm on the board surface 2 The continuous copper skin is used for the thickness gauge to place the probe, and the components on the circuit board are relatively dense, it is usually difficult to find a continuous copper skin that can meet the requirements, and the above measurement modes are to measure one point instead of the entire flat conformal coating film of the product To a certain extent, the measured value cannot truly reflect the thickness of the entire flat conformal coating film of the product

Method used

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  • Method, device and system for measuring thickness of conformal coating film
  • Method, device and system for measuring thickness of conformal coating film
  • Method, device and system for measuring thickness of conformal coating film

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Embodiment Construction

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0045] Because the thickness of the conformal coating film on the shoulder of the electronic component is a fixed value, the value is only related to the radius of the shoulder of the electronic component and the viscosity of the conformal coating material. Therefore, the conformal coating film will start from the shoulder of the electronic component and accumulate continuously downward along the slope of the solder joint of the electronic component package. T...

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Abstract

The invention provides a method for measuring the thickness of a conformal coating film. After obtaining the length L1 and height H of the components, the device packaging length L2 of the components and the aperture length L3 of the conformal coating film, according to the geometric relationship Calculate the thickness D of the conformal coating film in the flat area around the component. The method uses components on the circuit board as measurement points, does not require special layout requirements, and can check the thickness of the conformal coating film around each electronic component to accurately measure the thickness of the conformal coating film.

Description

technical field [0001] The invention relates to a conformal coating film measurement technology, in particular to a method, device and system for measuring the thickness of a conformal coating film. Background technique [0002] Conformal coating is a common way to protect circuit boards, and the measurement and control of conformal coating film thickness plays an important role in its protective ability. If the conformal coating film is too thin, the protective ability cannot meet the requirements; if the conformal coating film is too thick, cracks will occur in the temperature shock environment, making the protective ability invalid. [0003] According to GB_T 13452.2-1992, the current methods of measuring conformal coating film thickness include mechanical method, magnetic induction dry film thickness gauge and wet film thickness measurement method. The above method has certain space layout requirements for the product, for example, it is required to have 9mm on the boar...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B21/08G01B11/06
Inventor 于红娇董则宇
Owner BEIJING JINGWEI HIRAIN TECH CO INC
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