Laminated boring technology for combined soft and hard printed circuit boards

Abstract

The invention discloses a laminated boring technology for combined soft and hard printed circuit boards. The technology comprises steps that, a heat radiation aluminum sheet, a wood backing board and three combined soft and hard printed circuit boards are assembled and fixed on a mechanical drilling machine; the mechanical drilling machine starts, chip removal is realized, pressure feet of the mechanical drilling machine compress an upper surface of the heat radiation aluminum sheet, a drill needle moves downwards, the heat radiation aluminum sheet is firstly drilled through, the combined soft and hard printed circuit board on the uppermost layer is drilled, the drill needle is lifted up when the combined soft and hard printed circuit board on the uppermost layer is just drilled through; the drill needle moves downwards another time for drilling, the drill needle is lifted up when the combined soft and hard printed circuit board on the middle layer is just drilled through, the drill needle moves downwards another time for drilling, the drill needle is lifted up when the combined soft and hard printed circuit board on the lowest layer is just drilled through; the machine stops, and the boards are taken down. Through the technology, production efficiency is greatly improved, production cost is reduced, sectional drilling is employed, and quality is improved.

Description

technical field [0001] The invention discloses a stacked plate drilling process of a soft-hard combined printed circuit board, which belongs to the technical field of PCB mechanical process. Background technique [0002] With the development of science and technology, the progress of society and the improvement of people's living standards, electronic products are gradually developing from consumer electronics to short, small, light, and thin. The soft-rigid board is soft, foldable, and bendable. It can move freely along the three directions of X, Y, and Z, and can be used for wiring in three-dimensional space, so that the narrow space of instruments and meters can be fully utilized to meet the development trend of miniature and light electronic products. In the field of electronic products, high-tech fields such as automobiles and aerospace have been vigorously promoted and applied. [0003] Rigid-flex board is a combination of flexible (Flex) and rigid (Rigid) circuit boa...

AI Technical Summary

Problems solved by technology

[0004] There are two main ways for ordinary (Normalflow) PP to become medium and low flow glue PP, one is to dry PP by heating to reduce its flow glue, and the other is to add large particle molecules to ordinary PP to hinder the flow of glue so that The second method is generally used in the industry to become low-flow glue. However, there are air bubbles inside the medium-low flow glue PP produced in this way, and it is easy to be scratched and loosened by powder chips when drilling. After Desmear, PTH and electroplating, slice Afterwards, very serious thick holes appeared, and some even showed folded plating and broken holes.

[0005] This kind of quality problem is especially obvious in the soft-hard bonded board with a thickness of 40~60mil of two sheets of medium and low flow glue PP laminated. Under certain conditions, the powder chips generated during the drilling process cannot be discharged in time, and remain in the hole. The high-speed rotation of the drill pin drives the powder chips to scratch the PP, causing the PP to loosen.

The research found that this quality problem can be improved by reducing the number of stacked boards to 1pnl / stack. The analysis shows that when 1pnl / stack is drilled, the powder chips are discharged more smoothly and will not scratch the PP. This solves the problem of thick holes, but it brings cost increases. The problem of high and low production efficiency