A label feeding device
A label and label feeding technology, applied in the field of label feeding device, can solve the problems of many parts and high operating cost
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0031] like Figures 1 to 7Shown is a preferred embodiment of a volume label delivery device of the present invention, the volume label delivery device is mainly composed of an adsorption type label mechanism and a forming die 3, and the adsorption type label mechanism is mainly composed of a label inlet die 1, a label The mold core 2, the mold core driving assembly and the pushing assembly are composed of the pushing assembly consisting of the pushing part 4 and the telescoping part 5. In the direction of gravity, the working position of the labeling mold core 2 and the working position of the forming die 3 are distributed up and down. relationship, the forming die 3 is connected with a turntable mechanism, and the work of the turntable mechanism drives the forming die 3 to leave or move to just below the adsorption type label mechanism, and the working part of the label core 2 extends into the label entry mold 1, and the label The working part of the mold core 2 is provided ...
Embodiment 2
[0038] The difference from Embodiment 1 is that, as Figure 8 As shown, the cross section of the annular part of the pushing part 4 is an annular structure, the inner edge of the annular structure is circular, and the outer edge is a rectangle with rounded corners; correspondingly, the cross section of the core hole 11 is also The edges are rectangles with rounded corners. Similarly, the cross-section of the forming die hole 31 is also rectangular with rounded corners.
Embodiment 3
[0040] The difference from Embodiment 1 is that, as Figure 9 As shown, the working part 42 of the pushing part 4, that is, the end surface of the pipe is a concave arc surface.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


