Electronic device
A technology of electronic equipment and devices, applied in the field of electronic equipment, can solve the problems of increasing the cost of testing or maintenance, increasing the difficulty of separation, etc.
Active Publication Date: 2015-12-30
LENOVO (BEIJING) LTD
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Problems solved by technology
However, in the separation process of LCD and TP, due to the strong viscosity of the double-sided adhesive, it will increase the difficulty of separation, and in the separation process, due to the strong viscosity of the double-sided adhesive, it is destructive and irreversible, so that the LCD and TP are separated during the separation process. Different degrees of damage occur in the process, which requires replacement of damaged components, increasing testing or repair costs
Method used
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Embodiment Construction
[0027] An embodiment of the present invention provides an electronic device, including at least a first device and a second device, wherein the first device and the second device are bonded by an adhesive, and the outside of the first device and the second device is not in contact with Under the action of factors, the structure of the adhesive changes so that the viscosity of the adhesive decreases, and the first device and the second device will automatically separate after the viscosity is reduced to a certain level. Therefore, in the electronic device provided by the embodiment of the present invention, the first device It can be automatically separated from the second device without contact. Compared with the manual separation of the first device and the second device by the operator, it will reduce the difficulty of separation and reduce the strong adhesion of the adhesive during the separation process. The damage rate of the first component and the second component is red...
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The invention provides an electronic device which at least comprises a first device and a second device. The first device and the second device can be glued through a binder. Under the external factor effects without contact with the first device and the second device, the structure of the binder undergoes changes, so that the viscosity of the binder is reduced; after the viscosity is lowered, the first device and the second device can be separated automatically, and accordingly the device separation difficulty is reduced. Compared with a mode of manual separation of the first device and the second device by operators, the mode of reducing the viscosity of the binder under the external factor effects without contact with the first device and the second device so as to automatically separate the first device and the second device can reduce the damage rate of the first device and the second device caused by the high viscous force effects of the binder in the separating process, and accordingly the probability of replacement of the first device and the second device caused by damage is lowered, and the device cost is reduced.
Description
technical field [0001] The present invention relates to the technical field of equipment, and more specifically, to an electronic equipment. Background technique [0002] In existing electronic equipment, LCD (Liquid Crystal Display, liquid crystal display) and TP (Touch Panel, touch panel) are bonded together with double-sided adhesive to form a touch screen module, and then the touch screen module is installed in the housing of the electronic device. [0003] If the electronic equipment test fails or the electronic equipment is repaired after sale, the LCD and TP need to be separated. However, in the separation process of LCD and TP, due to the strong viscosity of the double-sided adhesive, it will increase the difficulty of separation, and in the separation process, due to the strong viscosity of the double-sided adhesive, it is destructive and irreversible, so that the LCD and TP are separated during the separation process. Different degrees of damage occur in the devic...
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IPC IPC(8): G06F3/041
Inventor 王瑜
Owner LENOVO (BEIJING) LTD