Asymmetric rigid-flex printed circuit board manufacturing method
A technology of rigid-flex board and manufacturing method, which is applied in printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problems of increasing cost input, lengthening process flow, and difficulty in controlling the uniformity of filling thickness of fillers. Smooth, narrow incision, the effect of preventing side erosion
Inactive Publication Date: 2015-12-30
双鸿电子(惠州)有限公司
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Problems solved by technology
However, on the one hand, covering the filler increases the cost input and lengthens the process flow; on the other hand, it is difficult to control the uniformity of the filling thickness of the filler, and the actual improvement effect is not ideal
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Embodiment 1
[0032] refer to Figure 1 to Figure 3 , the method for manufacturing an asymmetric rigid-flex board provided in this embodiment mainly includes the following steps:
[0033] Step 1, providing a flexible circuit board 1 with circuit fabrication completed, which includes a flexible circuit board bonding surface 11 and a flexible circuit board exposed surface 12, and the flexible circuit board bonding surface 11 is mainly composed of an exposed area 111 and a bonding surface Area 112; provide a rigid circuit board 2, which includes a rigid circuit board bonding surface 21 and a rigid circuit board exposed surface 22.
[0034] The circuit fabrication of the flexible circuit board 1 can be realized according to the traditional technology, and will not be repeated here. The exposed area 111 on the pressing surface 11 of the flexible circuit board refers to the area where the rigid circuit board 2 above it is hollowed out in the subsequent process, and the pressing area 112 refers t...
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The invention discloses an asymmetric rigid-flex printed circuit board manufacturing method. The method mainly comprises the steps that a flexible circuit board of which circuit manufacturing is completed and a rigid circuit board are supplied; a groove is cut in the rigid circuit board, and the cutting depth of the groove is smaller than the thickness of the rigid circuit board; thermal compression bonding is performed on the flexible circuit board and the rigid circuit board; circuit manufacturing is performed on the rigid circuit board; cutting is performed along the trail enclosed by the groove, and the area, enclosed by the groove, of the rigid circuit board is cut off. According to the asymmetric rigid-flex printed circuit board manufacturing method, the forming mode that cutting is performed for two times is adopted, and therefore the bad influences generated by a hollow area of the rigid circuit board on thermal compression bonding and rigid circuit board manufacturing are effectively avoided.
Description
technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing an asymmetric rigid-flex board. Background technique [0002] In the field of circuit board technology, rigid-flex board refers to the combination of flexible circuit board and rigid circuit board. plate. The rigid-flex board combines the structure of the flexible circuit board and the rigid circuit board. It not only has the characteristics of flexible circuit boards that can be bent and folded, it is used to make custom circuits and maximize the use of available space; it also includes rigid circuit boards. Hardness, used to ensure the impact resistance of the circuit board under strength. Therefore, rigid-flex boards have been widely used in aerospace, advanced medical equipment, digital cameras and other fields. Common rigid-flex board structures include symmetrical type, asymmetrical type, book type, flying tail type and shielded typ...
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IPC IPC(8): H05K3/36
CPCH05K3/361H05K2203/065
Inventor 陈江波
Owner 双鸿电子(惠州)有限公司