An ion trap device and method for reducing contamination of a straight electron gun cathode

Abstract

The invention discloses an ion trap device and method for reducing straight type electron gun cathode contamination and belongs to the straight type electron gun technical field. The ion trap device comprises an ion trap electric conduction strip arranged in a groove of a water cooling anode holder and an ion trap insulation layer which ensures insulation of the ion trap electric conduction strip and the groove of the water cooling anode holder. When evaporation material vapor enters a gun chamber from a main vacuum chamber and moves towards a cathode component under a vacuum chamber pressure difference effect, the evaporation material vapor collides with electron beam flows, and will be partially ionized, and the ionized vapor will be adsorbed by an ion trap, and can be prevented from entering the electron gun, and therefore, filament and grid contamination can be reduced, and the service life of a filament can be prolonged, and the stability of a machining process can be improved.

Description

technical field [0001] The invention relates to an ion trap device for reducing the pollution of the cathode of a straight electron gun, more precisely, an ion trap device for reducing the pollution of the cathode high-voltage components such as the grid and the filament of the straight electron gun from the vapor of the evaporation material. After the ion trap is set in the straight electron gun, the pollution degree of the cathode high-voltage parts by the evaporation material vapor can be effectively reduced, the service life of the filament of the electron gun can be prolonged, and the operation stability of the electron gun can be improved. Background technique [0002] Electron beam technology is a high-energy beam technology that uses electron beams as a heat source. At present, electron beam-based surface modification (such as surface remelting densification, hardening, texturing, etc.), smelting (such as purification of refractory metals), coatings (such as thermal ...

AI Technical Summary

Problems solved by technology

However, in the environment where there is a large amount of processed material vapor such as melting or coating evaporation, the vacuum pressure difference between the electron gun chamber and the main vacuum chamber will cause the vapor in the main vacuum chamber to move along the beam outlet of the electron gun to the electron gun chamber, and Ionization occurs when it interacts with the electron beam, and the ionized vapor moves to the vicinity of the filament of the electron gun, and attaches to the filament and the grid to cause pollution

Filament contamination reduces filament life and may affect thermionic emission beam current density, causing electron beam current fluctuations

When the electron beam fluctuates seriously, on the one hand, it will affect the processing quality of the workpiece, and even cause local overheating and burning of the workpiece; on the other hand, it will affect the stability of the processing process, such as causing target splashing during the coating process, resulting layer defect

When the gate is polluted, it is easy to cause the electron gun to "ignite", causing the process to stop

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