Electronic component bending component capable of adjusting terminal bending length

Abstract

The invention discloses an electronic component bending component capable of adjusting the terminal bending length. The electronic component bending component comprises a rack with a horizontal top plate, a lifting drive mechanism installed on the horizontal top plate, a bending assembly connected with the lifting drive mechanism, a positioning bottom plate located below the bending assembly, and a lower die plate. An electronic component is placed on a base plate located below the positioning bottom plate and positioned in a die plate hole and a positioning hole of the positioning bottom plate. The base plate can ascend and descend through a second lifting drive mechanism, and then the length of the part, upwards protruding out of the lower die plate, of a terminal is adjusted. The bending assembly comprises an upper combined plate and a bending module. A telescopic air cylinder is installed on one side of the upper combined plate and connected with the bending module. Lateral pushing forming can be carried out after the terminal of the electronic component is bent, and it is prevented that the shape of the bent terminal resets, and the preset shape is lost.

Description

Technical field: [0001] The invention relates to electronic component processing equipment, in particular to a bending mechanism with adjustable length of bending terminals of electronic components. Background technique: [0002] The terminals of some electronic components need to be bent before they can be used. The bending equipment in the prior art generally uses the upper module to press down on the electronic components positioned on the bottom module to bend the terminals of the electronic components. However, due to the properties of the terminal material of the electronic component, when the bending process is completed and the upper module rises and resets, the bent terminal of the electronic component will bounce back to a certain extent. Invention content: [0003] Technical problem solved by the present invention: [0004] First, in the electronic component bending equipment in the prior art, when the bending process is completed, after the upper module used t...

AI Technical Summary

Problems solved by technology

However, due to the performance of the electronic component terminal material itself, when the bending process is completed, after the upper module rises and resets, the bent terminal of the electronic component will have a certain degree of shape rebound

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