Ultra-precision Machining Method of Gallium Oxide Substrate
An ultra-precision machining and gallium oxide technology, which is applied in metal processing equipment, manufacturing tools, grinding devices, etc., can solve problems such as cleavage of crystal materials, high cost of consumables, environmental pollution, etc., so as to avoid processing difficulty And the effect of rising processing cost and reducing processing cost
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[0027] The present invention will be further described below in conjunction with specific embodiments.
[0028] figure 1 It is the process flow chart of traditional sapphire ultra-precision machining, figure 2 It is a process flow chart of the ultra-precision machining method for gallium oxide substrates of the present invention.
[0029] Abrasive particle size classification representation method: particle size number "W", particle size unit "micron"; abrasive particle size increases with the increase in the value after "W", for example, W0.5 means that the abrasive particle size distribution is less than 0.5 micron Within the range, W1.5 means that the abrasive particle size distribution range is between 0.5 and 1.5 microns. In addition, the particle size number can also be expressed by "mesh". The abrasive particle size becomes smaller with the increase of the "mesh" value. There are different standards for screen specifications in different countries and industries, so ...
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