A pick-and-place arm mechanism

Abstract

The embodiment of the invention provides a picking and placing arm mechanism which comprises a connecting portion, a front arm, a connecting seat, a pressure adjusting block, a clamping block, a height adjusting spring, a pressure adjusting head, a sucking and picking portion, an upper contact and a lower contact. A sliding block is arranged on the second lateral side of the connecting seat; a guiding rail is arranged on the clamping block, a guiding rail is connected with the sliding block, and the guiding rail can move along the sliding block towards the first direction; the upper contact is electrically connected with a controller; and the lower contact is electrically connected with the controller. When the bottom of the sucking and picking portion doesn't contact a wafer to be picked, the bottom of the upper contact abuts against the top of the lower contact, and the upper contact, the controller and the lower contact can form a loop. When the bottom of the sucking and picking portion contacts the wafer to be picked, the guiding rail moves along the sliding block towards the first direction, the guiding rail can driven the clamping block to move towards the first direction, the bottom of the upper contact breaks away the top of the lower contact, and the loop is disconnected. The picking and placing arm mechanism can accurately pick the wafer to be picked in the situation that the wafer to be picked is prevented from being damaged.

Description

technical field [0001] The invention relates to the field of semiconductor equipment manufacturing, in particular to a pick-and-place arm mechanism. Background technique [0002] A light emitting diode (LED, Light Emitting Diode) is a solid-state semiconductor device capable of converting electrical energy into visible light. In the post-packaging process of the LED production process, there is a necessary process flow, which is to pick up the core part of the LED (that is, the chip) from the blue film and place it in the tray, and apply a certain pick-up pressure so that The wafer is separated from the blue film, picked up by the suction head, and put into the tray, and then enters the next process. [0003] At present, in the LED manufacturing industry, many equipment manufacturers use the elastic connection between the forearm and the fixed arm to realize the flexible contact between the suction head and the wafer. This method has the following disadvantages: [0004] (...

AI Technical Summary

Problems solved by technology

[0004] (1) When the suction head is in contact with the wafer and continues to press down, the forearm will be lifted up and form a certain angle with the fixed arm. Since the total length of the welding arm is fixed, the head of the suction head has a slight movement in the horizontal direction. Displacement, and there is a small angle with the horizontal plane, which will inevitably cause damage to the surface of the wafer and also have a certain impact on the stability of the equipment

[0005] (2) The pick-up pressure of this method is non-linear adjustment, which is not easy to operate and prone to broken crystals and other phenomena

[0006] (3) During the process of picking up the wafer, the micro-horizontal displacement generated during the suction of the crystal leads to a decrease in the precision of the crystal suction and the crystal-fixing precision

[0007] (4) Different types of wafers require different heights for suction and bonding, which makes it difficult to adjust the height of suction and bonding, and the accuracy is low

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