Multiple LED chip pickup device

Abstract

The invention discloses a multiple LED chip pickup device comprising an integrated backboard, a pickup push plate and pickup units. The pickup push plate is installed on the lower portion of the integrated backboard. The number of the pickup units is four. Each pickup unit comprises a mount cylinder, supports and a suction nozzle. The mount cylinder is vertically installed on the middle portion of the integrated backboard. The mount cylinder is located over the pickup push plate. A through hole is formed in the pickup push plate. The piston rod end of the mount cylinder passes through the through hole and is rotatably connected with the pickup push plate. The lower end of the suction nozzle has a tapered hollow columnar structure. The suction nozzle is installed on the end portion of the piston rod end of the mount cylinder. The number of the supports is two. Both of the two supports are installed on the suction nozzle. Each support is obliquely provided with an infrared sensor for detecting the LED chip position. The two infrared sensors are arranged symmetrically. According to the invention, the problem of complex pickup working process caused by the single suction nozzle automatic suction mode can be effectively solved, and at the same time, the advantage of accurate pickup can be realized.

Description

technical field [0001] The invention relates to an LED placement machine system, in particular to a multi-head LED chip pick-up device for LED chip placement. Background technique [0002] Generally speaking, the LED placement machine is one of the SMT (Surface Mount System) placement machines. With the development of LED technology, the traditional SMT placement machine can no longer meet the production needs of the LED industry. At this time, the LED The placement machine came into being. LED placement machine is a SMT placement equipment specially designed and customized for the LED industry. It is used to realize the assembly of large quantities of LED circuit boards, and the equipment requires fast speed. [0003] In order to improve the working efficiency of the LED chip mounter, the current LED chip mounter often uses multiple suction nozzles to perform the mounting operation at the same time. At this time, higher requirements are put forward for the picking operatio...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the shortcomings in the prior art above, and provide a multi-head LED chip pick-up device, which has a simple structure, reasonable design and good use effect. operation, which can effectively solve the problem that the existing single suction nozzle self-pickup method complicates the picking process, and at the same time picks up accurately

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