Cooling unit for targeted cooling of electronic and/or electrical components
A technology for cooling devices and electrical components, applied in the direction of electrical components, electrical equipment structural parts, output power conversion devices, etc., can solve problems such as damage to the functionality and life of electronic and/or electrical components, and achieve the goal of avoiding heat accumulation Effect
Active Publication Date: 2018-08-03
VALEO EAUTOMOTIVE GERMANY GMBH
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- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
This lost heat impairs the functionality and lifetime of the electronic and / or electrical components, so efficient heat dissipation is required, ie a cost-effective but efficient removal of the lost heat is required
Method used
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Embodiment Construction
[0033] figure 1 A three-dimensional view of a cooling body 4 is shown in , which is conventionally used, for example, for cooling electronic and / or electrical components. The heat sink 4 has an inlet 11 for the supply 13 of the cooling medium and an outlet 12 for the discharge 14 of the cooling medium 7 . The cooling medium 7 surrounds the plurality of projecting cooling elements 5 of the cooling body 4 by means of a hierarchical one-dimensional structured flow direction 15 that is partly swirled. Since the intensity and duration of the heat dissipation of the cooling body 4 are not equally required at every point of the cooling body 4, the cooling medium 7 is in most cases for all heat quantities to be output by the cooling body 4 This amount of heat can only be completely absorbed and dissipated by means of the loose design and often oversized construction of the cooling system. The cooling of the electronic and / or electrical components that are thermally coupled to the he...
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The invention relates to a cooling device for cooling an electronic and / or electric element, particularly a power semiconductor which is configured on a circuit board. The device is provided with the components of at least one cooling member which is provided with projected heat radiating members which are configured on the surface of the cooling member, wherein the cooling member is thermally coupled with the electronic and / or electric element; at least one cooling medium distributing member which is used for spatially distributing cooling medium to hot spots which are defined by the cooling member in a targeted manner; a cooling device inner chamber which is surrounded by the cooling member and a cooling member tank that can be connected with the cooling member, wherein the cooling device inner chamber at least comprises the projected heat radiating member of the cooling member and the cooling medium distributing member; at least one inlet for conveying the cooling medium into the cooling device inner chamber; and at least one outlet for discharging the cooling medium out of the cooling device inner chamber. Furthermore the cooling device is applied in a converter, and particularly the converter of an electric vehicle or hybrid electric vehicle.
Description
technical field [0001] The invention relates to a cooling device for cooling electronic and / or electrical components, in particular power semiconductors arranged on a circuit board, having at least one cooling body with protruding heat sinks arranged on the surface of the cooling body components, wherein the cooling body is provided for thermal coupling with electronic and / or electrical components. Background technique [0002] Electronic and / or electrical components, as they are used, for example, in industrial converters or in converters for electric or hybrid vehicles, are usually designed for high Electric continuous power and peak power. During operation, these electronic and / or electrical components cause in most cases non-negligible electrical losses, which are mostly converted into loss heat. This heat loss impairs the functionality and lifetime of the electronic and / or electrical components, so efficient heat dissipation is required, that is to say cost-effective ...
Claims
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IPC IPC(8): H05K7/20H02M1/00
CPCH01L23/473B60L50/00H01L23/3672H01L2924/0002H05K7/20927H01L2924/00
Inventor 米夏埃尔·莱佩纳特克里斯蒂安·卢茨
Owner VALEO EAUTOMOTIVE GERMANY GMBH