A method for preparing LEDs with different luminescent colors based on metal nanocluster packaging materials
A technology of metal nano-clusters and encapsulation materials, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of high cost, low luminous efficiency, and small reserves of the earth, and achieve the effect of low risk and easy operation
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Embodiment 1
[0028] In a 20mL beaker, add 5mL of 1-octadecene, and dissolve 0.2mmol of CuCl 2 2H 2 O (the concentration of the metal precursor solution is 0.01 mol / L), under magnetic stirring at room temperature, add 1 mmol of dodecyl mercaptan dropwise and keep stirring for 3 min to obtain dodecyl mercaptan-stabilized Cu nanoclusters . Maintaining stirring at room temperature for 0.5 h, a spherical assembly structure packaging material of Cu nanoclusters with a diameter of about 200 nm can be obtained, and the spherical assembly structure packaging material of Cu nanoclusters has orange-red fluorescence. Finally, after centrifugation, drying, and powder treatment (the product is about 30 mg, the powder mesh number is 400), the Cu chip assembly structure packaging material of 5 mg is taken and blended with the prepolymer of polydimethylsiloxane of 15 mg (mass ratio It is 1:3), and then coated on the GaN-based LED chip, and polymerized at 60°C for 2 hours to obtain a packaged LED light so...
Embodiment 2
[0030] Add 5mL 1-octadecene in a 20mL beaker, and dissolve 1.6mmol of CuCl 2 2H 2O (the concentration of metal precursor solution is 0.08mol / L), under magnetic stirring at room temperature, 1 mmol of dodecyl mercaptan was added dropwise and kept stirring for 3 min to obtain dodecyl mercaptan-stabilized Cu nanoclusters . Keep stirring at room temperature for 1 h to obtain a thin sheet of Cu nanoclusters (50-400 nm in length, 50-400 nm in width, and <5 nm in thickness) assembled structural packaging materials, which have pale yellow fluorescence. Finally, after centrifugation, drying and powdering treatment (the product is about 100 mg), 5 mg of Cu nanocluster sheet assembly structure packaging material was taken and blended with 15 mg of polydimethylsiloxane prepolymer (mass ratio is 1: 3), and then coated on a GaN-based LED chip, and polymerized at 80° C. for 5 hours to obtain a packaged LED light source that emits light yellow light.
Embodiment 3
[0032] In a 20 mL beaker, add 5 mL of 1-octadecene and dissolve 0.2 mmol of CuCl 2 ·2H 2 O. Under magnetic stirring at room temperature, 1 mmol of dodecyl mercaptan was added dropwise and kept stirring for 3 min to obtain dodecyl mercaptan-stabilized Cu nanoclusters. Maintaining stirring at 50°C for 3 hours, a thick sheet of Cu nanoclusters (100-400 nm in length, 100-400 nm in width, and >5 nm in thickness) assembled structural packaging materials can be obtained. Fluorescence. Finally, after centrifugation, drying and powdering treatment (the product is about 30 mg), 5 mg of Cu sheet was taken to assemble the structural packaging material, and it was blended with 15 mg of polydimethylsiloxane prepolymer (mass ratio was 1:3), Then, it is coated on a GaN-based LED chip and polymerized at 60° C. for 5 hours to obtain a packaged LED light source that emits green light.
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