Three-dimensional circuit manufacturing process and composite components of laser plastic material and manufacturing method

A technology of three-dimensional circuit and manufacturing process, which is applied in the fields of printed circuit manufacturing, cable/conductor manufacturing, circuit, etc. It can solve the problems that the three-dimensional circuit assembly technology has not been rapidly promoted, the microstructure is not smooth, and the appearance is affected, and the sintering time is shortened. , increase the speed, reduce the effect of concentration polarization

Active Publication Date: 2010-10-13
深圳市微航磁电技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] Because the laser irradiates the surface of the plastic, it will cause the pyrolysis of the organic metal compound, and at the same time make the microstructure of the deposited metal area not smooth. After the metal is thickened by electroless plating, it is still not smoot

Method used

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  • Three-dimensional circuit manufacturing process and composite components of laser plastic material and manufacturing method
  • Three-dimensional circuit manufacturing process and composite components of laser plastic material and manufacturing method
  • Three-dimensional circuit manufacturing process and composite components of laser plastic material and manufacturing method

Examples

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Example Embodiment

[0094] Implementation Example 1: Active GPS Plastic Antenna

[0095] like figure 2 shown, the active antenna consists of the antenna ( figure 2 A and figure 2 D) Add the antenna amplification part ( figure 2 C) composition, antenna metal pattern ( figure 2 D) Arranged on the laser plastic with polyethylene (PE) or syndiotactic polystyrene (SPS) as the carrier masterbatch ( figure 2 A), the composite components in the carrier masterbatch are: 1-10 grams of surfactants; 5-200 grams of compatibilizers; 0.1-5 grams of light absorbers; 0.5-30 grams of viscosity reducers; 5-750 grams of inorganic fillers ; Modified organometallic compound 30-50 grams; the rest are carrier masterbatch. The sum of the composite components must meet 100%.

[0096] The three-dimensional circuit manufacturing process is adopted, and the laser machine uses near-infrared laser (1064nm) or ultraviolet laser scanning; then rapid chemical copper plating; finally, the lead and the amplifier circuit...

Example Embodiment

[0098] Example 2: Multi-faceted high-power LED plastic lamp holder

[0099] The traditional LDE lamp holder is a ceramic base, which adopts the traditional chip ceramic resistance-capacitance process, sinters the terminal electrodes on the insulating ceramic chip, and then chemically plated copper, nickel, and gold. The ceramic process cannot make complex polyhedral shapes.

[0100] However, the luminous characteristics of LED lamps are direct light. Generally, high-power lamps are composed of several LEDs. In order to distribute the light sources in the hemispherical space, such as image 3 shown, the ideal arrangement of LED lights ( image 3 A) is a polyhedron arrangement, which is molded or injected into a plastic base with a thermally conductive laser plastic ( image 3 B).

[0101] The example of the present invention adopts the thermal conductive laser plastic raw material. One component is: the carrier masterbatch is CBT, and the composite components are: 1000 grams...

Example Embodiment

[0104] Implementation Example 3: Applications in the fields of automobiles and aircrafts

[0105] Automobiles, airplanes, train cars, etc. have large plastic parts and need to arrange a large number of cables to transmit various electronic signals. The traditional cables are combined with plastic through bolts, screws and hardware, which are heavy and easy to move during movement. It emits a sound. For products that are particularly sensitive to weight, such as airplanes, it is a very good measure to use the stereo circuit technology of the present invention to pre-embed a large number of signal lines in the plastic parts, which not only reduces the failure rate but also reduces the weight, and Easy to maintain. The main function of plastics used in automobiles is to lighten the weight of automobiles, so as to achieve the purpose of fuel saving and high speed. Developed countries regard the amount of plastic used in automobiles as an important indicator to measure the level o...

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Abstract

The invention relates to a three-dimensional circuit manufacturing process, in particular to a packaged technology which utilizes laser scanning to selectively deposit an accurate and tight conductive circuit pattern and directly welds electronic components on a plastic surface. The method comprises the following steps: 1, synthesizing the laser plastic material containing an organic metal compound; 2, carrying out injection molding on the laser plastic material to obtain plastic pieces; 3, selectively scanning the plastic pieces by laser to form a pattern reducing metal particles; 4, carrying out rapid ultrasonic electroless plating to thicken the metal layer on the pattern and form a continuous conductive pattern; and 5, carrying out plasma chemical polishing. The invention also fuses a laser layering sintering (SLS) rapid forming technology and contains a laser direct structuring (LDS), provides process and equipment innovation, and becomes an environmental-friendly and flexible intelligent manufacturing core technology for a new generation of electronic, electrical and electromechanical integrated products; and the invention can be applied to electronic industries, aerospace, transportation, industrial control and other fields.

Description

technical field [0001] The invention belongs to the field of intelligent and flexible manufacturing, and relates to a three-dimensional circuit manufacturing process and a composite component and manufacturing method of laser plastic raw materials. Specifically, laser selectively scans the surface of plastic parts made of laser plastic raw materials to form fine , the manufacturing process of the compact conductive pattern and the laser plastic raw material formulation components and synthesis method. Background technique [0002] The manufacturing process of electronic appliances and mechanical and electrical products and the direction of corresponding material technology progress are flexibility, environmental protection, environment friendliness and energy saving. For this reason, some advanced industrial manufacturing powers in the world, such as Germany, have simultaneously launched industrial research on three-dimensional circuit intelligent manufacturing with us, and ...

Claims

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Application Information

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IPC IPC(8): H01B13/00H01B17/64H01B1/00C08L101/00C08K13/02C08K13/04C08K5/41C08K3/26C08K7/20B29C45/00B29C43/00H05K3/10
CPCH05K1/0373H05K3/0014H05K3/105H05K3/182H05K2201/09118H05K2203/107B33Y80/00
Inventor 许小曙周红卫
Owner 深圳市微航磁电技术有限公司
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