Three-dimensional circuit manufacturing process and composite components of laser plastic material and manufacturing method
A technology of three-dimensional circuit and manufacturing process, which is applied in the fields of printed circuit manufacturing, cable/conductor manufacturing, circuit, etc. It can solve the problems that the three-dimensional circuit assembly technology has not been rapidly promoted, the microstructure is not smooth, and the appearance is affected, and the sintering time is shortened. , increase the speed, reduce the effect of concentration polarization
Active Publication Date: 2010-10-13
深圳市微航磁电技术有限公司
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The invention relates to a three-dimensional circuit manufacturing process, in particular to a packaged technology which utilizes laser scanning to selectively deposit an accurate and tight conductive circuit pattern and directly welds electronic components on a plastic surface. The method comprises the following steps: 1, synthesizing the laser plastic material containing an organic metal compound; 2, carrying out injection molding on the laser plastic material to obtain plastic pieces; 3, selectively scanning the plastic pieces by laser to form a pattern reducing metal particles; 4, carrying out rapid ultrasonic electroless plating to thicken the metal layer on the pattern and form a continuous conductive pattern; and 5, carrying out plasma chemical polishing. The invention also fuses a laser layering sintering (SLS) rapid forming technology and contains a laser direct structuring (LDS), provides process and equipment innovation, and becomes an environmental-friendly and flexible intelligent manufacturing core technology for a new generation of electronic, electrical and electromechanical integrated products; and the invention can be applied to electronic industries, aerospace, transportation, industrial control and other fields.
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Property | Measurement | Unit |
Diameter | 2.0 | µm |
Thickness | 0.5 ~ 2.0 | mm |
tensile | MPa | |
Particle size | Pa | |
strength | 10 |
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