SMD (surface mount device) resistor and SMD resistor bonding pad structure

Abstract

The invention discloses an SMD (surface mount device) resistor. The SMD resistor comprises a substrate, a first electrode, a second electrode and a third electrode, wherein the first electrode is arranged at one end of the substrate, and the second electrode is arranged at the other end of the substrate; the third electrode is arranged between the first electrode and the second electrode, a first resistor film is formed between the third electrode and the first electrode to form a first resistor, and a second resistor film is formed between the third electrode and the second electrode to form a second resistor. According to the SMD resistor of the embodiment of the invention, the use quantity of the resistors in a product can be effectively reduced, the material cost is saved, material control is facilitated, meanwhile, more PCB (printed circuit board) surface space can be saved, and realization of high-density product design is facilitated. The invention further discloses an SMD resistor bonding pad structure.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a chip resistor and a pad structure of the chip resistor. Background technique [0002] With the rapid development of intelligent electronic products, and the structure and layout of intelligent electronic products gradually turn to the rapid development trend of thinner and higher density. In electronic products, multiple signal lines are often equipped with pull-up or pull-down resistors, wherein one end of the resistor is connected to the signal line, the other end of the resistor is connected to the power supply or ground, and multiple signal lines are pulled or pulled down. It is the same power network or the same grounding network. [0003] In the related technology, it is realized by splicing a single independent resistor on each signal line or multiple signal lines splicing resistance, but splicing a single independent resistor will increase the number of resistors u...

AI Technical Summary

Problems solved by technology

[0003] In the related technology, it is realized by splicing a single independent resistor on each signal line or multiple signal lines splicing resistance, but splicing a single independent resistor will increase the number of resistors used, which is not conducive to material control, and occupies a large amount of space. There is a lot of PCB (Printed Circuit Board, printed circuit board) board space, and the splicing and exclusion method will increase the cost of materials

Therefore, no matter whether the method of splicing a single independent resistor or the method of splicing and exclusion is used, it is not conducive to the design and realization of the product.

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