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Preparation method of stepped groove of stepped circuit board and stepped circuit board

A technology for stepped grooves and circuit boards, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, three-dimensional rigid printed circuit boards, etc., can solve problems affecting the size and flatness of stepped grooves.

Active Publication Date: 2018-05-25
NEW FOUNDER HLDG DEV LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] For this reason, the technical problem to be solved by the present invention is to overcome the technical defect that the preparation method of the stepped groove of the stepped circuit board in the prior art can affect the size and flatness of the stepped groove

Method used

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  • Preparation method of stepped groove of stepped circuit board and stepped circuit board
  • Preparation method of stepped groove of stepped circuit board and stepped circuit board
  • Preparation method of stepped groove of stepped circuit board and stepped circuit board

Examples

Experimental program
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Effect test

Embodiment 1

[0038] The preparation method of the stepped groove of a kind of stepped circuit board provided by this embodiment, such as figure 1 shown, including the following steps:

[0039] S1: Form the primary step groove 1 on the circuit board substrate, such as figure 2 shown;

[0040] S2: Cover the bottom of the primary stepped groove 1 with a cured metal plate 3, the outer edge of the metal plate 3 is in contact with the inner wall of the primary stepped groove 1, as image 3 shown;

[0041] S3: Place an insulating spacer 4 smaller than the metal plate 3 on the upper part of the metal plate 3, such as image 3 shown;

[0042] S4: Lay the ungrooved outer core board 7 on the circuit board substrate, such as image 3 shown;

[0043] S5: laminating the outer core board 7 and the circuit board substrate;

[0044] S6: Form a stepped groove 8 at the position corresponding to the primary stepped groove 1, such as Figure 5 shown. As a preferred embodiment, controlled depth millin...

Embodiment 2

[0057] This embodiment provides a stepped circuit board, which has a stepped groove 8 prepared by any one of the implementation methods described in the first embodiment.

[0058] Since the stepped groove 8 is prepared by any one of the embodiments described in Example 1, the size and flatness of the stepped groove 8 are consistent with the preset size and flatness.

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Abstract

The invention provides a preparation method for a step trough of a step circuit board, and the step circuit board. The preparation method comprises the steps of: forming a primary step trough in a circuit board substrate; coating a metal plate after curing process at the bottom part of the primary step trough, wherein the outer edges of the metal plate are attached and in contact with the inwalls of the step trough; an insulating gasket smaller than the metal plate in size is placed on the upper part of the metal plate; unslotted outer layer core plates are laminated on the circuit board substrate; laminating the outer layer core plates and the circuit board substrate; and forming the step trough at a position corresponding to the primary step trough. When the lamination begins, an overflow glue flows onto the metal plate along a gap between the insulating gasket and the primary step groove, the overflow glue on the copper plate can be removed completely, thereby the step trough is manufactured. And the size and flatness of the prepared step trough of the step circuit board are consistent with the preset size and flatness.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for preparing stepped grooves of a stepped circuit board and the stepped circuit board. Background technique [0002] The development of small and diverse electronic products has greatly restricted space and safety. The traditional planar circuit board obviously cannot meet the requirements of electronic products in many fields, so stepped circuit boards have appeared. However, the manufacturing process of the stepped circuit board designed with a three-dimensional structure has always been a difficult problem for those skilled in the art. [0003] The preparation process of the traditional stepped circuit board includes the following steps: cutting process, forming a plurality of independent inner core boards used as inner layers, outer core boards used as outer layers, and connecting adjacent core boards The prepreg (generally epoxy resin); transfer the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/46
CPCH05K1/0284H05K3/4626
Inventor 刘大辉
Owner NEW FOUNDER HLDG DEV LLC
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