Detection method for glue residue on hole wall of PCB

Abstract

The invention discloses a detection method for a glue residue on the hole wall of a PCB. The detection method comprises the following steps: putting a detection sample in a solution capable of carrying out a replacement reaction with a copper film on the hole wall so that the replacement reaction of copper and the solution is carried out; observing the whole circular ring of the hole wall at the position of an inner-layer circuit of the PCB; judging whether glue removal is qualified according to the color of the whole circular ring of the hole wall, wherein the detection sample is the hole of the PCB deposited with the copper film on the hole wall. According to the detection method, as long as the detection sample is put in the solution capable of carrying out the replacement solution with the copper, the color of the whole circular ring of the hole wall at the position of the inner-layer circuit of the PCB can be intuitively observed after the reaction is completed so as to judge whether the glue removal is qualified, and an expensive fluorescence detector adopted in the prior art is not needed, so that the cost for detecting the glue residue on the hole wall is reduced, and the detection method is simple in detection process and easy in operation and can be widely popularized and applied in the preparation technology of PCB.

Description

technical field [0001] The invention relates to the technical field of detection of PCB boards, in particular to a detection method for glue slag on the hole wall of the PCB board. Background technique [0002] With the continuous development of PCB boards, the application of multi-layer structure PCB boards is becoming more and more extensive. With the increase of the number of PCB board layers, it is becoming more and more difficult to remove the glue residue on the hole wall after drilling holes on the PCB board. , because during the drilling process, the substrate material in the hole is melted at high temperature to form slag, a part of the slag is taken out of the hole by the drill bit, and the other part of the slag remains on the hole wall. Therefore, in the PCB board preparation process, all It is necessary to remove the glue on the hole wall after drilling, and test the degree of glue removal to judge whether the glue removal on the hole wall is qualified. If the ...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to overcome the defects of high cost and difficult to popularize and use in the PCB board preparation process of the prior art method for detecting glue slag on the hole wall of the PCB board, and provide a low-cost, simple operation and easy to popularize and use Detection method of glue slag on the hole wall of PCB board

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