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Manufacturing method of bonding equipment

A manufacturing method and a technology for laminating equipment, applied in the directions of bonding methods, optics, instruments, etc., can solve problems such as difficulties and achieve corresponding relaxed effects

Active Publication Date: 2018-09-04
SHIN ETSU ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This size is several tens of times higher than the film thickness (about 1 to 10 μm) of the adhesive in ordinary LCDs or LCMs. Jobs in the region are on a trend of becoming more difficult

Method used

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  • Manufacturing method of bonding equipment
  • Manufacturing method of bonding equipment
  • Manufacturing method of bonding equipment

Examples

Experimental program
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Embodiment 1

[0079] Next, various embodiments of the present invention will be described with reference to the drawings.

[0080] Such as Figure 1 ~ Figure 4 As shown, in this embodiment 1, in the supply process, the adhesive 3 is supplied in a substantially rectangular shape along the inner side of the boundary line of the rectangular display area D, and in the semi-curing process, the outer edge portion of the adhesive 3 is The specific part 3a' in 3a is semi-cured, excluding the corner part 3a1, and the entire filled part 3b is semi-cured. In the bonding process, the corner part 3a1 of the specific part 3a' is directed toward the corner part D2 of the unfilled region D1 in the display area D. stretch.

[0081] The laminating equipment A of Example 1 shows a case where there are not enough spare electronic components in the margins from the rectangular display area D to the outer edges of the first substrate 1 and the second substrate 2 such as LCD or LCM.

[0082] Figure 4 In the e...

Embodiment 2

[0094] Such as Figure 5 and Image 6As shown, in this embodiment 2, in the supply process, the adhesive 3 is supplied along the inner side of the boundary line of the rectangular display area D, and in the semi-curing process, the specified part of the outer edge portion 3a as the adhesive 3 The part 3a' is semi-cured at least the filled part 3b excluding the side part 3a2. In the bonding process, at least the side part 3a2 of the specific part 3a' faces the first substrate 1 and the unfilled area D4 outside the display area D. The bonding space S between the outer edge portions 1b, 2b of the second substrate 2 is extended, and this structure is consistent with Figure 1 ~ Figure 4 The example 1 shown is different, and the structure other than this is the same as Figure 1 ~ Figure 4 Example 1 shown is the same.

[0095] The laminating equipment A of Example 2 shows, for example, a case where there are relatively spare electronic components in the blank portion from the re...

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Abstract

The present invention provides a method of manufacturing a bonding device, which controls the stretching of the outer edge of the adhesive sandwiched between the first substrate and the second substrate, thereby covering the entire display area with the adhesive. After the adhesive (3) is supplied to either or both of the first substrate (1) or the second substrate (2) so as to be placed in the display area (D), the adhesiveness is maintained at a viscosity The filled part (3b) of the outer edge part (3a) of the adhesive (3) other than the specific part (3a') is semi-cured so that the viscosity becomes higher than that of other parts. Afterwards, the first substrate (1) and the second substrate (2) are stacked in such a way as to sandwich the adhesive (3), thereby identifying the unsemi-cured state in the outer edge portion (3a) of the adhesive (3). The part (3a') faces further than the outer edge part (3a) of the adhesive (3) due to capillary phenomenon or natural flow or pressurized flow generated between the first substrate (1) and the second substrate (2). The outer unfilled area ( D1 ) extends over the entire display area (D).

Description

technical field [0001] The present invention relates to a flat panel display (FPD) such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), a flexible display, or a touch panel type FPD or a 3D (3-dimensional ) Manufacturing method of lamination equipment for bonding a substrate such as a liquid crystal module (LCM) such as a display or an electronic book, or a flexible printed circuit board (FPC) to another substrate such as a cover glass, a cover film, or an FPD. Background technique [0002] Conventionally, as a method of manufacturing such bonding equipment, there is a bonding method in which a supply unit supplies an adhesive (ultraviolet curable resin) over the entire one surface of a workpiece. A part of the adhesive (the outer edge of the adhesive supply area) or the entire adhesive that has spread over the entire one side of the workpiece is irradiated with electromagnetic waves (ultraviolet rays) in the atmosphere before bonding...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G09F9/00G02F1/13
CPCC09J5/00G02F1/133308G02F1/133608G02F2202/28C09J2203/318G02F1/133325H10K59/8722
Inventor 坂下光邦大谷义和
Owner SHIN ETSU ENG