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electronic components

A technology of electronic components and parallel parts, applied in electrical components, transformer/inductor components, circuits, etc., can solve problems such as long length, and achieve the effect of suppressing temperature rise and large-scale

Active Publication Date: 2018-04-13
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the length of the stacking direction of the electronic components is long.

Method used

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Experimental program
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Effect test

no. 1 approach

[0018] (Structure of Electronic Components)

[0019] Hereinafter, the structure of the electronic component 10a which concerns on 1st Embodiment is demonstrated, referring drawings. figure 1 It is an external perspective view of electronic components 10a-10f. figure 2 It is an exploded perspective view of the laminated body 12 of the electronic component 10a. image 3 Yes figure 1 A cross-sectional structure diagram of the electronic component 10a of AA. In addition, in image 3 In , hatching of the laminated body 12 is omitted in order to prevent the drawing from becoming complicated. Hereinafter, the lamination direction is defined as the up-down direction, and the directions in which both sides of the laminated body 12 extend are defined as the front-rear direction and the left-right direction when viewed from above.

[0020] like figure 1 as well as figure 2 As shown, the electronic component 10a is equipped with the laminated body 12, external electrode 14a, 14b,...

no. 2 approach

[0110] Hereinafter, the structure of the electronic component 10b which concerns on 2nd Embodiment is demonstrated, referring drawings. Figure 4A as well as Figure 4B It is an exploded perspective view of the laminated body 12 of the electronic component 10b which concerns on 2nd Embodiment. Reference to the perspective view of the appearance of the electronic component 10b figure 1 .

[0111] like Figure 4A as well as Figure 4B As shown, the electronic component 10b is equipped with the laminated body 12, external electrode 14a, 14b, the coil L, and via-hole conductors v1-v3, v74-v77.

[0112] The laminated body 12 is in the shape of a cuboid, such as Figure 4A as well as Figure 4B As shown, insulator layers 16a to 16z and 16aa to 16mm are sequentially stacked from the upper side to the lower side. The laminated body 12 and the insulator layers 16a to 16z and 16aa to 16mm of the electronic component 10b are the same as the laminated body 12 and the insulator laye...

no. 3 approach

[0151] Hereinafter, the structure of the electronic component 10c which concerns on 3rd Embodiment is demonstrated, referring drawings. Figure 4C Yes figure 1 The cross-sectional structure diagram on A-A of the electronic component 10c of .

[0152] The electronic component 10c differs from the electronic component 10a in the number of the parallel part 20 provided in each of area|region A1-A3, and the number of the parallel part 22.

[0153] In the electronic component 10c, the parallel part 20a and the parallel part 22a are provided in order from the upper side to the lower side in the area|region A1. Thereby, the parallel part 20a is provided in the uppermost side among the parallel part 20a, 22a provided in area|region A1. In addition, in the area A1, the number (one) of the parallel units 20 is equal to the number (one) of the parallel units 22 .

[0154] In the region A3, a parallel portion 22h and a parallel portion 20d are provided in this order from the upper side...

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Abstract

The purpose of the present invention is to provide an electronic component which can suppress increase in temperature of elements while suppressing increase in size of the elements. A coil (L) is provided with parallel units (20) comprising two coil conductors, which are arranged side-by-side in the vertical direction and are connected in parallel, and parallel units (22) comprising three coil conductors, which are arranged side-by-side in the vertical direction and are connected in parallel. The proportion of the number of parallel units (20) in the sum of the number of parallel units (20) and the number of parallel units (22) in area (A1), when viewed in plan view from the right side, is greater than the proportion of the number of parallel units (20) in the sum of the number of parallel units (20) and the number of parallel units (22) in area (A2), when viewed in plan view from the right side.

Description

technical field [0001] The present invention relates to electronic components, and more particularly, to laminated coil components. Background technique [0002] As a conventional invention related to an electronic component, for example, the electronic component described in Patent Document 1 is known. This electronic component incorporates a coil constituted by connecting a plurality of coil conductors with via-hole conductors. In addition, two adjacent coil conductors in the stacking direction have the same shape and are connected in parallel by via-hole conductors. In the electronic component described in Patent Document 1 as described above, the DC resistance value of the coil is small, heat generation in the coil is suppressed, and temperature rise of the electronic component is suppressed. [0003] However, in the electronic component described in Patent Document 1, all the coil conductors are connected in parallel two by two. Therefore, there is a problem that the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/00H01F27/00H01F27/08H01F27/29
CPCH01F17/0013H01F17/0033
Inventor 小野崎纪道立花薰
Owner MURATA MFG CO LTD
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