Cantilever-type probe system for parallel testing of multiple radio frequency chips

Abstract

The invention provides a cantilever-type probe system for the parallel testing of multiple radio frequency chips, and the system comprises a probe card board and at least two chip detection units. Each chip detection unit detects one radio frequency chip, and each chip detection unit comprises an insulating ring and a probe, wherein the insulating rings are fixed on the probe card board, and the probes are fixed with the insulating rings. One end, far from the tip, of each probe is welded with the probe card board. Shielding layers are disposed among the chip detection units. When the system is used for the paralleling testing of multiple radio frequency chips, the system effectively reduces the radio frequency crosstalk among the radio frequency probes, and can effectively enable the radio frequency crosstalk among the probes to be reduced by 5dB-10dB under the condition that the cost of a probe card is basically not increased.

Description

technical field [0001] The invention belongs to the field of semiconductors, and relates to a cantilever probe system used in parallel testing of multiple radio frequency chips. Background technique [0002] With the development of modern communication technology and the progress of consumer electronics, radio frequency chips are widely used or integrated in consumer electronics products, wireless devices and intelligent control devices. At present, the frequency of RF chips tested at the wafer level is getting higher and higher, but the cost is constantly decreasing. When testing RF chips at the wafer level from 1.5GHz to 12GHz, in order to improve the test efficiency and reduce the test cost, it is necessary to use a cantilever probe. The needle system (that is, the cantilever probe card) tests multiple RF chips at the same time, that is, multiple parallel tests to further reduce the test cost. When the cantilever probe card is used for simultaneous testing of multiple RF...

AI Technical Summary

Problems solved by technology

However, since the cantilever probe card puts all the probes on the same epoxy ring, the shielding layer can only be placed at the intersection of the RF probe and the epoxy ring, inside the epoxy ring and the entire needle tip. In some cases, the RF signals of multiple RF chips still crosstalk each other and cannot be effectively shielded, so that the cantilever probe card cannot be truly effectively parallel tested

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