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Assembly for handling a semiconductor die and method of handling a semiconductor die

A technology for semiconductor tubes and assemblies, which is applied in the field of assemblies and semiconductor chips for processing semiconductor chips, and can solve problems such as the occurrence of cracks 106

Active Publication Date: 2016-03-30
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This uneven stress (caused by ejection pins) may cause cracks 106 to appear on or within semiconductor die 102

Method used

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  • Assembly for handling a semiconductor die and method of handling a semiconductor die
  • Assembly for handling a semiconductor die and method of handling a semiconductor die
  • Assembly for handling a semiconductor die and method of handling a semiconductor die

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Embodiment Construction

[0023] The following detailed description refers to the accompanying drawings, which show by way of illustration specific details and embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. Other embodiments may be utilized and structural and logical changes may be made without departing from the scope of the present invention. The various embodiments are not necessarily mutually exclusive, as some embodiments can be combined with one or more other embodiments to form new embodiments.

[0024] The word "exemplary" is used herein to mean "serving as an example, instance or illustration". Any embodiment or design described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments or designs.

[0025] The term "over" used with reference to a deposited material formed "over" a side or surface may be used herein to mean...

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Abstract

The invention relates to an assembly for handling a semiconductor die and a method of handling a semiconductor die. In various embodiments of an assembly for handling of a semiconductor chip is provided. The assembly may comprise a support with a surface. The assembly may also comprise an adhesive tape which is attached to the surface of the carrier. The adhesive tape can be configured so that it adheres to the semiconductor chip. The adhesive tape may comprise an adhesive, the adhesion can be reduced by means of electromagnetic waves. The assembly may further include an electromagnetic source that is configured to apply electromagnetic waves to the adhesive tape in order to reduce the adhesion of the adhesive tape on the semiconductor chip. The assembly may further comprise a chip receiving component configured to receive the semiconductor chip from the adhesive tape.

Description

technical field [0001] Aspects of the present disclosure relate to assemblies for processing semiconductor dies and methods of processing semiconductor dies. Background technique [0002] One of the main causes of cracks in semiconductor dies is the uneven mechanical stress applied to the backside of the die by push-up or ejector needles during pick-up. [0003] figure 1 is a schematic diagram 100 showing semiconductor die 102 being pushed by ejector pins 104 . The ejector pins 104 exert a force on the backside of the semiconductor die 104 . This uneven stress (caused by ejection pins) may cause cracks 106 to appear on or in semiconductor die 102 . Contents of the invention [0004] In various embodiments, an assembly for processing a semiconductor die is provided. The assembly may include a carrier having a surface. The fitting may also include an adhesive strip secured to the surface of the carrier. The adhesive tape may be configured to adhere to the semiconductor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/673H01L21/50
CPCH01L21/50H01L21/67H01L21/67121H01L21/673H01L21/67115H01L21/67132H01L2221/68327H01L2221/68381Y10T156/1132Y10T156/1158Y10T156/1917Y10T156/1983Y10T156/1944Y10T156/1179B32B43/006H01L21/6836B32B38/10B25J11/0095B32B37/0046H01L21/67092H01L21/6838
Inventor N·V·比科芒R·P·约韦斯J·克里什南T·G·库纳马尼李光明A·O·苏马格波亚陈建雄童顺福
Owner INFINEON TECH AG