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Magnetic Field Generating System in Magnetic Induction Free Abrasive Wire Saw Cutting

A magnetic induction and magnetic field technology, applied in the direction of magnets, magnetic objects, permanent magnets, etc., can solve the problems of reduced cutting ability of free abrasive wire saws, increased kerf length and depth, increased demand for silicon wafers, etc., to achieve easy integration with machine tools Combination, reduction of kerf width, and the effect of easy magnetic field strength

Active Publication Date: 2018-01-09
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Crystalline silicon solar cells are dominant in the photovoltaic industry. These factors have led to a sharp increase in the demand for silicon wafers, especially due to the increase in the size of silicon crystals, the increase in the length and depth of the slit, and the difficulty of abrasive grains entering the long and In deep kerfs, the cutting ability of the loose abrasive wire is reduced

Method used

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  • Magnetic Field Generating System in Magnetic Induction Free Abrasive Wire Saw Cutting
  • Magnetic Field Generating System in Magnetic Induction Free Abrasive Wire Saw Cutting
  • Magnetic Field Generating System in Magnetic Induction Free Abrasive Wire Saw Cutting

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Embodiment Construction

[0011] The present invention will be further described below in conjunction with the accompanying drawings.

[0012] refer to Figure 1 ~ Figure 3 , a magnetic field generating system in wire saw cutting with magnetically induced free abrasive particles, the magnetic field generating system includes a magnetic pole 22, an electromagnetic coil 21, a permanent magnet 23 and a yoke 24, and between the upper ends of the two magnetic poles 22 is a magnetically induced free abrasive particle The processing station of wire saw cutting, the electromagnetic coils 21 are respectively installed on the upper ends of the magnetic poles 22, the opposite faces of the two electromagnetic coils 21 are respectively opposite polarities, the lower ends of the magnetic poles 22 are connected with the permanent magnets 23, and the permanent magnets 23 are connected to each other. The polarity of the upper part of the magnet 23 is opposite to the polarity of the electromagnetic coil 21 at the magnet...

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Abstract

The invention provides a magnetic field production system applied to magnetic-induction free abrasive wire saw cutting. The magnetic field production system comprises magnetic poles, electromagnetic coils, permanent magnets and a magnet yoke, wherein a processing station for the magnetic-induction free abrasive wire saw cutting is formed between the upper ends of the two magnetic poles; the electromagnetic coils are mounted at the upper ends of the magnetic poles respectively, and relative surfaces of the two electromagnetic coils are in opposite polarity; the lower ends of the magnetic poles are connected with the permanent magnets, and the polarity of the upper part of each permanent magnet is opposite to that of the surface, far away from the other electromagnetic coil, of the electromagnetic coil of the corresponding magnetic pole; the two ends of the magnetic yoke are connected with the permanent magnets respectively. Four areas of high-gradient magnetic fields can be formed on the periphery of a wire saw under the assistance of outside uniform magnetic fields, and the cutting efficiency is improved, and the slit width is reduced.

Description

technical field [0001] The invention relates to a magnetic field generating system, more specifically to a uniform magnetic field generating system used in magnetic induction free abrasive wire saw cutting. Background technique [0002] Primary energy sources such as oil and coal are gradually depleted, and environmental pollution is intensified, resulting in a sharp increase in demand for solar energy utilization. Crystalline silicon solar cells are dominant in the photovoltaic industry. These factors lead to a sharp increase in the demand for silicon wafers, especially due to the increase in the size of silicon crystals, the increase in the length and depth of the kerf, and the difficulty of abrasive grains entering the long and In deep kerfs, the cutting ability of the free abrasive wire saw is reduced. Magnetic induction free abrasive wire saw cutting is to place the ferromagnetic saw wire vertically in a uniform magnetic field, forming four areas around the saw wire, w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F7/02B28D5/04
CPCB28D5/045H01F7/0278
Inventor 姚春燕李贺杰张威刘坤许雪峰彭伟
Owner ZHEJIANG UNIV OF TECH