A method of making a package substrate

A technology for encapsulating substrates and manufacturing methods, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as the Giavani effect and achieve the effect of protecting the metallization layer

Active Publication Date: 2018-08-07
SHENNAN CIRCUITS
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] An embodiment of the present invention provides a method for manufacturing a packaging substrate, which is used to solve the problem of Giavani effect in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method of making a package substrate
  • A method of making a package substrate
  • A method of making a package substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Please refer to figure 1 , an embodiment of the present invention provides a method for manufacturing a packaging substrate, which may include:

[0025] 101. Fabricate the outer pattern of the packaging substrate, the outer pattern at least includes a first pattern, a second pattern, and an insulating groove between the first pattern and the second pattern;

[0026] Please refer to figure 2 , making the outer pattern of the packaging substrate, the outer pattern is attached to the substrate 100, the outer pattern at least includes a first pattern 110, a second pattern 111, and a pattern between the first pattern 110 and the second pattern 111 The insulating groove 112 between them.

[0027] It should be noted that the substrate may be a substrate composed of resin glass fibers, which is not specifically limited here.

[0028] 102. Metallize the entire package substrate, so that a metallized layer is formed on the surface of the package substrate;

[0029] Please re...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a manufacturing method of a packaging substrate. The method includes: making an outer pattern of the packaging substrate, the outer pattern at least including a first pattern, a second pattern, and a pattern between the first pattern and the second pattern. insulating grooves between the second patterns; metallizing the entire package substrate so that a metallized layer is formed on the surface of the package substrate; providing a resist film on the package substrate, and the resist film Covering the area other than the wire bonding area of ​​the first pattern and the second pattern; removing the metallization layer of the wire bonding area, and plating a nickel-gold layer on the wire bonding area; The protective layer is plated on the surface of the layer; the resist film and the metallization layer are removed; a solder resist layer is provided on the package substrate, and then the protective layer is removed to complete the manufacture of the package substrate. The embodiments of the present invention are used to solve the problem of Giavanni effect in the prior art.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a packaging substrate. Background technique [0002] With the continuous development of electronic products in the direction of miniaturization, thinning and multi-function, integrated circuit packaging is also required to develop in the direction of thinning and high density. As the carrier of integrated circuit packaging, the wiring density of the packaging substrate is also increasing. keep improving. [0003] At present, many integrated circuit packages adopt the wire bonding process, which requires the substrate bonding fingers to be treated with electroplated nickel gold. Due to the increase in wiring density, many substrates have no space for separate design of electric gold leads. Therefore, it is necessary to use leadless electro-gold technology. The lead electro-gold process is usually electroplated nickel-gold on the wire-bonding fing...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48
Inventor 谷新
Owner SHENNAN CIRCUITS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap