Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electronic device testability modeling evaluation method

A kind of electronic equipment and testability technology, applied in the direction of electrical digital data processing, error detection/correction, instruments, etc., can solve the problems of rough processing, inconvenient testability prediction evaluation, low accuracy of testability simulation evaluation results, etc.

Active Publication Date: 2016-04-20
NO 63908 TROOPS PLA
View PDF2 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) Models based on certainty cannot deal with the uncertainty of testing, such as information flow models, multi-signal flow graph models, etc.;
[0005] (2) A model that can deal with test uncertainty, but cannot reflect the hierarchical structure of the equipment, is not convenient for the testability prediction and evaluation in the early stage of equipment design, such as the testability Bayesian network model;
[0006] (3) It is unrealistic to determine the conditional probability of nodes in the testable model through a large number of experiments. Most of the results are directly given based on assumptions or expert experience, and the processing is relatively rough, resulting in low accuracy of testable simulation evaluation results

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic device testability modeling evaluation method
  • Electronic device testability modeling evaluation method
  • Electronic device testability modeling evaluation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0098] A system consists of two functional modules c 1 and c 2 Composed of a total of f 1 ,f 2 ,f 3 ,f 4 ,f 5 ,f 6 and f 7 etc. 7 failure modes, designed t 1 ,t 2 ,t 3 ,t 4 ,t 5 and t 5 Wait for 5 tests. Functional module c built according to the testable layered hybrid modeling method 1 A model fragment such as figure 1 shown. The functional block has 4 failure modes f 1 ,f 2 ,f 3 and f 4 , corresponding to 3 tests t 1 ,t 2 and t 3 .

[0099] Functional module c built according to the testable layered hybrid modeling method 2 A model fragment such as figure 2 shown. The functional block has 3 failure modes f 5 ,f 6 and f 7 , corresponding to 2 tests t 4 and t 5 .

[0100] After the model fragments of each functional module are established, connect the model fragments according to the module association relationship and fault propagation relationship, and establish a testable layered hybrid model of the entire system, as shown in image 3 show...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an electronic device testability modeling evaluation method, and relates to the technical field of device testing. The electronic device testability modeling evaluation method comprises the following steps of 1) determining the modeling object; 2) building a testability hierarchical mixture model; 3) adjusting, correcting and verifying the built testability hierarchical mixture model, and evaluating the accuracy of the built model; and 4) analyzing and evaluating the device testability. The electronic device testability modeling evaluation method has good observability, the association and dependency relation between faults and tests can be reflected, and the structural relation and the fault propagation relation between system modules can be reflected; multi-source testability information can be fused to carry out testability quantitative analysis and evaluation, at the same time, the electronic device testability modeling evaluation method has hierarchy, small fragment testability models such as subsystems or function modules are combined to form the testability model of the whole system, the modeling difficulty level is reduced, and the testability model can be extended and modified conveniently.

Description

technical field [0001] The invention relates to the technical field of equipment testing. Background technique [0002] During the demonstration and design stage of the equipment scheme, early test evaluation can be achieved by establishing a test model. At the same time, with the deepening of equipment development, the model should also be able to integrate test information such as expert experience information and historical test data generated in the process of equipment development, so as to improve the accuracy of test simulation evaluation results. [0003] At present, there are still three deficiencies in model-based test simulation evaluation: [0004] (1) Models based on determinism cannot handle the uncertainty of testing, such as information flow models, multi-signal flow graph models, etc.; [0005] (2) A model that can deal with test uncertainty, but cannot reflect the hierarchical structure of equipment, which is inconvenient for the evaluation of testability...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F11/34
CPCG06F11/3447
Inventor 连光耀孙江生闫鹏程孙连武曹卫宁张西山李会杰蔡丽影王凯周云川邱文昊魏忠林厚泽潘国庆王承红
Owner NO 63908 TROOPS PLA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products